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MSP430F1132IDWR

Texas Instruments

MSP430F1132IDWR by Texas Instruments

MSP430F1132IDWR by Texas Instruments is a 16-bit microcontroller with 8 MHz max clock frequency, 256B RAM, and 5-Ch 10-Bit ADC. Ideal for industrial applications requiring low power consumption, it features BOR, TIMER(3), WDT peripherals and operates in temperature range of -40 to 85°C.

Median Price

$3.840

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,993 parts In-Stock

1+ parts

$3.840

100+ parts

$3.365

1k+ parts

$1.901

10k+ parts

-

17,993

$3.840

$3.365

$1.901

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 235 parts In-Stock

1+ parts

$3.648

100+ parts

-

1k+ parts

-

10k+ parts

-

235

$3.648

-

-

-

Vyrian

USA . 3,036 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,036

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,252 parts In-Stock

1+ parts

$3.456

100+ parts

-

1k+ parts

-

10k+ parts

-

3,252

$3.456

-

-

-

AZTECH Wire

Italy . 819 parts In-Stock

1+ parts

$18.470

100+ parts

-

1k+ parts

-

10k+ parts

-

819

$18.470

-

-

-

Parana Technologies

USA . 1,094 parts In-Stock

1+ parts

$52.647

100+ parts

-

1k+ parts

-

10k+ parts

-

1,094

$52.647

-

-

-

DigiPath Technology Company

USA . 160 parts In-Stock

1+ parts

$57.971

100+ parts

-

1k+ parts

-

10k+ parts

-

160

$57.971

-

-

-

IDEA Electronic Components Group

UK . 2,049 parts In-Stock

1+ parts

$59.154

100+ parts

$56.196

1k+ parts

$53.239

10k+ parts

-

2,049

$59.154

$56.196

$53.239

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ChromeModa Solutions

Germany . 1,454 parts In-Stock

1+ parts

$59.154

100+ parts

$48.506

1k+ parts

-

10k+ parts

-

1,454

$59.154

$48.506

-

-

Perfect Parts

USA . 4,480 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,480

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Overview

Unlock the potential of your electronics projects with the MSP430F1132IDWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This microcontroller is perfect for applications requiring low power consumption and high performance, making it ideal for a wide range of projects. With its compact size and advanced features, the MSP430F1132IDWR offers exceptional value and benefits to customers looking to take their designs to the next level. Trust Texas Instruments to deliver superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster and more efficient data processing.

Package Shape: RECTANGULAR

The rectangular shape is a standard form factor, making integration into existing designs easier.

Bit Size: 16

A 16-bit architecture provides the ability to handle more complex computations and data operations.

Power Supplies (V): 2/3.3

This dual power supply option allows for compatibility with a wider range of electronic components.

No. of Terminals: 20

Having a sufficient number of terminals enables connection to external devices and peripherals.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, ideal for compact designs.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 85 °C

The high operating temperature range makes the product suitable for industrial environments.

CPU Family: MSP430

The MSP430 family is known for its low-power consumption, making this product energy-efficient.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable performance in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Having ADC channels allows for analog inputs to be converted to digital signals, increasing the versatility of the product.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit board layout and connection options.

ROM Words: 8192

The large ROM capacity allows for storing program codes and data, making the product suitable for a wide range of applications.

Maximum Seated Height: 2.65 mm

The low seated height makes the product suitable for compact designs with limited vertical space.

RAM Words: 0.25

Although small, the RAM capacity is sufficient for storing temporary data during operations.

Width: 7.5 mm

The narrow width saves space on the circuit board, ideal for applications with size constraints.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the product during manufacturing.

Peripherals: BOR, TIMER(3), WDT

The presence of built-in peripherals such as Brown-Out Reset, Timers, and Watchdog Timer adds functionality and flexibility to the product.

Maximum Clock Frequency: 8 MHz

The high clock frequency enables fast processing speed, suitable for real-time applications.

Peak Reflow Temperature °C: 260

The high reflow temperature tolerance ensures reliability during the assembly process.

Length: 12.8 mm

The compact length dimension saves space on the circuit board, ideal for miniaturized designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates robustness and reliability in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it offers high performance and efficiency in executing instructions.

No. of Timers: 3

Multiple timers allow for precise timing and synchronization of various operations within the product.

RAM Bytes: 256

With a sufficient RAM capacity, the product can efficiently handle data processing and storage requirements.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

The gull-wing terminal form offers easy soldering and strong mechanical connections for reliable operation.

Analog To Digital Convertors: 5-Ch 10-Bit

Having multiple ADC channels with a high bit resolution enables accurate conversion of analog signals to digital data.

Maximum Supply Current: 0.35 mA

The low maximum supply current helps in minimizing power consumption, making the product energy-efficient.

Nominal Supply Voltage: 2.2 V

The nominal supply voltage provides a stable operating voltage for consistent performance of the product.

PWM Channels: YES

The presence of PWM channels allows for precise control of the product's output signals, essential for various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates of firmware, enhancing the product's versatility.

Terminal Pitch: 1.27 mm

The standard terminal pitch simplifies PCB layout and assembly, ensuring compatibility with industry-standard components.

Format: FIXED POINT

A fixed-point format for data representation offers simplicity and efficiency in arithmetic operations.

Speed: 8 rpm

The high-speed capability of 8 rpm allows for quick data processing and real-time control in dynamic applications.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption during idle or low-load operation, increasing energy efficiency.

On Chip Program ROM Width: 8

With an on-chip program ROM width of 8, the product can store instructions efficiently for quick access and execution.

No. of I/O Lines: 14

Having multiple I/O lines enables versatile connectivity and interaction with external devices, expanding the product's functionality.

Technical Specifications

Microcontrollers MSP430F1132IDWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY @ 3MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

14

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Peripheral IC Type:

Peripherals:

"BOR, TIMER(3), WDT"

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430F1132IDWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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