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MSP430F1101AIDWR

Texas Instruments

MSP430F1101AIDWR by Texas Instruments

MSP430F1101AIDWR by Texas Instruments is a 16-bit microcontroller with 1024 ROM words and 128 RAM bytes. Operating at a max clock frequency of 8 MHz, it features peripherals like comparator, POR, and timers suitable for industrial applications. With low power mode and PWM channels, this CMOS technology-based MCU offers high performance in a small outline package.

Median Price

$2.291

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,400 parts In-Stock

1+ parts

$2.291

100+ parts

$2.007

1k+ parts

$1.134

10k+ parts

-

17,400

$2.291

$2.007

$1.134

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,941 parts In-Stock

1+ parts

$2.176

100+ parts

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2,941

$2.176

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Maritex

Poland . 3,374 parts In-Stock

1+ parts

$2.613

100+ parts

$1.631

1k+ parts

$1.324

10k+ parts

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3,374

$2.613

$1.631

$1.324

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Vyrian

USA . 2,147 parts In-Stock

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2,147

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Bristol Electronics

USA . 657 parts In-Stock

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-

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$1.254

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$1.102

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657

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$1.254

$1.102

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Dan-Mar Components

USA . 657 parts In-Stock

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657

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EMSNET

USA . 590 parts In-Stock

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590

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Distributors (Availability)

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Corphita

USA . 1,056 parts In-Stock

1+ parts

$2.062

100+ parts

-

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1,056

$2.062

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Component Stockers USA

USA . 16,705 parts In-Stock

1+ parts

$3.340

100+ parts

$2.460

1k+ parts

$1.230

10k+ parts

$1.230

16,705

$3.340

$2.460

$1.230

$1.230

Parana Technologies

USA . 1,743 parts In-Stock

1+ parts

$36.366

100+ parts

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1,743

$36.366

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DigiPath Technology Company

USA . 888 parts In-Stock

1+ parts

$40.044

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888

$40.044

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ChromeModa Solutions

Germany . 2,298 parts In-Stock

1+ parts

$40.861

100+ parts

$33.506

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2,298

$40.861

$33.506

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IDEA Electronic Components Group

UK . 1,082 parts In-Stock

1+ parts

$40.861

100+ parts

$38.818

1k+ parts

$36.775

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1,082

$40.861

$38.818

$36.775

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Lixinc

USA . 13,631 parts In-Stock

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13,631

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Perfect Parts

USA . 13,440 parts In-Stock

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A-Z Elektronik GmbH

Germany . 12,552 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Futuretech Components

Singapore . 836 parts In-Stock

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836

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F1101AIDWR microcontroller. Built by a trusted manufacturer, this powerful device offers unmatched quality and reliability. Ideal for a wide range of applications, this microcontroller provides value by delivering efficient performance and versatility. Experience the benefits of seamless operation and innovative features that set this product apart. Upgrade your projects with the MSP430F1101AIDWR and discover a world of endless opportunities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliable performance for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Support for maximum supply voltage of 3.6 V provides flexibility in power supply options.

Package Shape: RECTANGULAR

Rectangular package shape enables easy placement and mounting within electronic devices.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages (2V and 3.3V) allows for versatile application compatibility.

No. of Terminals: 20

Having 20 terminals provides sufficient connectivity options for interfacing with other components.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage of 1.8 V helps in saving power and increasing efficiency.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and makes the microcontroller suitable for compact designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance in various environmental conditions.

ROM Words: 1024

Large ROM capacity of 1024 words allows for storing program instructions and data efficiently.

RAM Bytes: 128

Ample RAM storage of 128 bytes enables efficient data processing and manipulation.

Maximum Clock Frequency: 8 MHz

Support for a maximum clock frequency of 8 MHz allows for fast processing speeds and responsiveness.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller ensures efficient execution of instructions for improved performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade makes the microcontroller suitable for use in harsh operating conditions.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 enhances data handling and processing capabilities.

Technical Specifications

Microcontrollers MSP430F1101AIDWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

14

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"COMPARATOR, POR, TIMER(3), WDT"

Trade Compliance

MSP430F1101AIDWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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