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MSP430AFE232IPW

Texas Instruments

MSP430AFE232IPW by Texas Instruments

MSP430AFE232IPW by Texas Instruments is a 16-bit microcontroller with 24 terminals, operating at up to 12 MHz. Ideal for industrial applications, it features dual ADC channels, SPI and UART connectivity, and low power mode with a max supply current of 4.5 mA.

Median Price

$2.572

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 20 parts In-Stock

1+ parts

$0.769

100+ parts

-

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-

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20

$0.769

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Rochester

USA . 695 parts In-Stock

1+ parts

$2.160

100+ parts

$2.120

1k+ parts

$2.070

10k+ parts

-

695

$2.160

$2.120

$2.070

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Texas Instruments

USA . 4,360 parts In-Stock

1+ parts

$4.450

100+ parts

$3.899

1k+ parts

$2.203

10k+ parts

-

4,360

$4.450

$3.899

$2.203

-

DigiKey

USA . 9 parts In-Stock

1+ parts

$5.510

100+ parts

$3.646

1k+ parts

$3.248

10k+ parts

$3.084

9

$5.510

$3.646

$3.248

$3.084

Chip1Stop

Japan . 179 parts In-Stock

1+ parts

-

100+ parts

$2.572

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-

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179

-

$2.572

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Verical

USA . 20 parts In-Stock

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20

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Distributors (In-Stock)

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Digiode

USA . 237 parts In-Stock

1+ parts

$1.921

100+ parts

-

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-

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237

$1.921

-

-

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TME

Poland . 10 parts In-Stock

1+ parts

$5.100

100+ parts

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10

$5.100

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-

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Vyrian

USA . 5,686 parts In-Stock

1+ parts

-

100+ parts

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5,686

-

-

-

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Bristol Electronics

USA . 772 parts In-Stock

1+ parts

-

100+ parts

$2.192

1k+ parts

$1.926

10k+ parts

-

772

-

$2.192

$1.926

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Dan-Mar Components

USA . 772 parts In-Stock

1+ parts

-

100+ parts

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772

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,223 parts In-Stock

1+ parts

$1.820

100+ parts

-

1k+ parts

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10k+ parts

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3,223

$1.820

-

-

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Microchip USA

USA . 2,521 parts In-Stock

1+ parts

$16.520

100+ parts

$16.280

1k+ parts

$16.170

10k+ parts

$16.050

2,521

$16.520

$16.280

$16.170

$16.050

Parana Technologies

USA . 1,312 parts In-Stock

1+ parts

$53.466

100+ parts

-

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1,312

$53.466

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DigiPath Technology Company

USA . 2,175 parts In-Stock

1+ parts

$58.873

100+ parts

$54.163

1k+ parts

-

10k+ parts

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2,175

$58.873

$54.163

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ChromeModa Solutions

Germany . 5,876 parts In-Stock

1+ parts

$60.074

100+ parts

$49.261

1k+ parts

-

10k+ parts

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5,876

$60.074

$49.261

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IDEA Electronic Components Group

UK . 560 parts In-Stock

1+ parts

$60.074

100+ parts

$57.070

1k+ parts

$54.067

10k+ parts

-

560

$60.074

$57.070

$54.067

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Perfect Parts

USA . 1,407 parts In-Stock

1+ parts

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1,407

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Overview

Unleash the power of innovation with the MSP430AFE232IPW by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers top-notch quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering low power consumption and high performance. With features like analog to digital converters, PWM channels, and connectivity options like SPI and UART, this product provides unmatched value and benefits to customers looking to take their projects to the next level. Trust Texas Instruments to provide cutting-edge technology that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring reliable performance over time.

Surface Mount: YES

Surface mount technology offers space-saving benefits and allows for easy integration into compact electronic devices.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply options, making it versatile for different applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and soldering on circuit boards.

Bit Size: 16

With a 16-bit architecture, the microcontroller can handle more complex tasks and calculations efficiently.

No. of Terminals: 24

Sufficient terminals for interfacing with external components and peripherals, enabling versatile connectivity options.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space on the circuit board and enables high-density designs.

Minimum Supply Voltage: 1.8 V

Allows for operation in low-power applications and extends the battery life of portable devices.

Maximum Operating Temperature: 85 °C

Capable of operating in industrial environments with a wide temperature range, ensuring reliability in various conditions.

CPU Family: MSP430

Belongs to a reputable CPU family known for its low power consumption and high performance, making it a reliable choice for power-efficient applications.

Minimum Operating Temperature: -40 °C

Able to withstand extreme cold temperatures, ideal for applications in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good electrical conductivity, corrosion resistance, and solderability, ensuring reliable connections.

ADC Channels: YES

Built-in analog-to-digital converters allow for interfacing with analog sensors and signals, expanding the range of applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in board layout and routing, optimizing design efficiency.

ROM Words: 8192

Sufficient memory for storing program instructions and data, enabling complex algorithms and applications.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications, promoting compact and slim device designs.

Width: 4.4 mm

Narrow width enables placement in tight spaces and allows for high-density mounting on PCBs.

Boundary Scan: YES

Boundary scan capability for debugging, testing, and diagnosing the microcontroller during development and production.

Peripherals: BOR, POR, TIMER(3), WDT

Includes essential peripherals like brown-out reset, power-on reset, timers, and watchdog timer for enhanced functionality and reliability.

Maximum Clock Frequency: 12 MHz

High clock frequency allows for fast processing and execution of tasks, suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for a specified duration, ensuring proper soldering during manufacturing.

Peak Reflow Temperature °C: 260

Capable of withstanding high temperatures during the reflow soldering process, ensuring reliable assembly.

Length: 7.8 mm

Compact length for space-saving designs and easy integration into small form factor devices.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature environments, suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient and fast processing, making it ideal for applications requiring high performance.

RAM Bytes: 512

Provides ample memory for data storage and processing, enabling multitasking and complex computations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical strength and solder joint reliability, ensuring long-term durability.

Analog To Digital Convertors: 2-Ch 24-Bit

High-resolution ADCs allow for accurate conversion of analog signals, suitable for precision measurement applications.

Maximum Supply Current: 4.5 mA

Low supply current consumption for energy-efficient operation, ideal for battery-powered devices.

Nominal Supply Voltage: 2.2 V

Optimal supply voltage level for stable and reliable operation, ensuring consistent performance.

PWM Channels: YES

Pulse-width modulation channels for precise control of output signals, suitable for motor control and power management applications.

Connectivity: SPI, UART, USART

Multiple communication interfaces for versatile connectivity options with external devices and peripherals.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, enabling firmware updates and modifications.

Terminal Pitch: 0.65 mm

Narrow terminal pitch for high-density mounting on PCBs, enabling compact and miniaturized designs.

Speed: 12 rpm

Operates at a speed of 12 rotations per minute, suitable for applications requiring precision timing and control.

Low Power Mode: YES

Low power consumption mode for energy-efficient operation and extended battery life, ideal for portable and battery-powered devices.

On Chip Program ROM Width: 8

8-bit wide on-chip program ROM for storing program instructions, enabling efficient execution of code.

No. of I/O Lines: 11

Sufficient I/O lines for interfacing with external devices and peripherals, providing versatile connectivity options.

Technical Specifications

Microcontrollers MSP430AFE232IPW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

11

No. of Terminals:

24

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

12 rpm

Maximum Supply Current:

4.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART, USART

Peripherals:

BOR, POR, TIMER(3), WDT

Analog To Digital Convertors:

2-Ch 24-Bit

Trade Compliance

MSP430AFE232IPW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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