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MSP430A155IPZ

Texas Instruments

MSP430A155IPZ by Texas Instruments

MSP430A155IPZ by Texas Instruments is a 16-bit microcontroller with 72 I/O lines, 8-Ch 10-Bit ADC, and 4 timers. Ideal for industrial applications due to its low power mode, operating temperature range of -40 to 85 °C, and max clock frequency of 16 MHz. Package style: Flatpack, low profile, fine pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,105 parts In-Stock

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7,105

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Digiode

USA . 2,150 parts In-Stock

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2,150

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Distributors (Availability)

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AZTECH Wire

Italy . 432 parts In-Stock

1+ parts

$9.636

100+ parts

-

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432

$9.636

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One Stop Electronics

USA . 1,275 parts In-Stock

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$24.000

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1,275

$24.000

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Parana Technologies

USA . 1,274 parts In-Stock

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$57.281

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1,274

$57.281

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DigiPath Technology Company

USA . 1,946 parts In-Stock

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$63.074

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1,946

$63.074

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IDEA Electronic Components Group

UK . 2,302 parts In-Stock

1+ parts

$64.361

100+ parts

$61.143

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$57.925

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2,302

$64.361

$61.143

$57.925

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ChromeModa Solutions

Germany . 1,666 parts In-Stock

1+ parts

$64.361

100+ parts

$52.776

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1,666

$64.361

$52.776

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Component Stockers USA

USA . 1,237 parts In-Stock

1+ parts

$98.110

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$98.110

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Corphita

USA . 3,901 parts In-Stock

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3,901

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Overview

Unlock endless possibilities with the Texas Instruments MSP430A155IPZ microcontroller. Designed with precision and expertise, this high-quality product offers unparalleled value to customers in a variety of applications. From smart home devices to industrial automation, this powerful microcontroller provides unmatched performance and reliability. Experience the benefits of cutting-edge technology with Texas Instruments and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the microcontroller, ensuring its longevity and reliability.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of applications.

No. of Terminals: 100

High number of terminals allows for versatile connectivity options and integration with various systems and peripherals.

ADC Channels: YES

Built-in Analog to Digital Converters enable the microcontroller to interface with analog sensors and signals, expanding its functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances the processing efficiency and speed of the microcontroller, making it suitable for real-time applications.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast execution of instructions and overall improved performance of the microcontroller.

Technical Specifications

Microcontrollers MSP430A155IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

72

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(4)

Peripherals:

BOR, DMA(3), POR, TIMER(4), RTC, WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430A155IPZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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