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MSP430A152IRGCR

Texas Instruments

MSP430A152IRGCR by Texas Instruments

MSP430A152IRGCR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at max 32 MHz. It features 12-Ch 12-Bit ADC channels and DMA support. Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,906 parts In-Stock

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Digiode

USA . 4,288 parts In-Stock

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4,288

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Distributors (Availability)

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AZTECH Wire

Italy . 772 parts In-Stock

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$15.677

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772

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One Stop Electronics

USA . 418 parts In-Stock

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$33.000

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418

$33.000

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Parana Technologies

USA . 1,873 parts In-Stock

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$42.663

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DigiPath Technology Company

USA . 815 parts In-Stock

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$46.977

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$43.219

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815

$46.977

$43.219

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ChromeModa Solutions

Germany . 3,647 parts In-Stock

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$47.936

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$39.308

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3,647

$47.936

$39.308

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IDEA Electronic Components Group

UK . 1,804 parts In-Stock

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$47.936

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$45.539

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$43.142

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1,804

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$43.142

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Corphita

USA . 1,116 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments MSP430A152IRGCR microcontroller. Designed to deliver top-notch performance, this chip is perfect for a wide range of applications. Its cutting-edge technology and reliable construction make it a standout choice for any project. With low power consumption and a multitude of peripherals, this microcontroller offers unparalleled value and functionality. Trust Texas Instruments to provide you with the best in microcontroller innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options.

No. of Terminals: 64

With a high number of terminals, this microcontroller can accommodate a wide range of connections and peripherals.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures operational reliability in various environmental conditions.

ADC Channels: YES

The presence of analog-to-digital converters allows for precise measurement and control of analog signals.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce the load on the CPU.

ROM Words: 16384

The large ROM capacity allows for storing a significant amount of program data.

Maximum Clock Frequency: 32 MHz

The high clock frequency enables fast processing speeds and responsiveness.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances efficiency and performance of the microcontroller's operation.

RAM Bytes: 6144

The ample RAM capacity allows for efficient data storage and manipulation during operation.

Technical Specifications

Microcontrollers MSP430A152IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

6144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI(2), UART, USB, USCI

Peripherals:

BOR, COMPARATOR, CRC, DMA(3), RTC, TIMER(18), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430A152IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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