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MSP430A064IPM

Texas Instruments

MSP430A064IPM by Texas Instruments

MSP430A064IPM by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at a max frequency of 8 MHz. It features 2 timers, 8-channel ADC, and low power mode suitable for industrial applications. With a supply voltage range of 1.8V to 3.6V, it offers connectivity via SPI, UART, and USART interfaces.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,854 parts In-Stock

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Digiode

USA . 2,243 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 576 parts In-Stock

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$7.366

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One Stop Electronics

USA . 987 parts In-Stock

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$10.000

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987

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Microchip USA

USA . 1,119 parts In-Stock

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$28.410

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$28.000

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$27.800

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$27.600

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$27.600

Parana Technologies

USA . 1,329 parts In-Stock

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$70.763

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DigiPath Technology Company

USA . 55 parts In-Stock

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$77.919

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$71.685

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55

$77.919

$71.685

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ChromeModa Solutions

Germany . 1,470 parts In-Stock

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$79.509

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$65.197

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IDEA Electronic Components Group

UK . 1,305 parts In-Stock

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$79.509

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$75.534

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$71.558

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Component Stockers USA

USA . 1,058 parts In-Stock

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$134.640

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Corphita

USA . 2,696 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments MSP430A064IPM microcontroller. Designed for efficiency and reliability, this versatile device offers a wide range of applications in various industries. With advanced features like low power mode, 8-channel ADC, and multiple connectivity options, this microcontroller provides unparalleled value to customers seeking high performance in a compact package. Trust in Texas Instruments' reputation for quality and experience the difference with the MSP430A064IPM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for package body.

Surface Mount: YES

Easier to mount on PCBs, saving time and effort in assembly.

Maximum Supply Voltage: 3.6 V

Ability to handle higher voltage applications with a safety margin.

On Chip Data RAM Width: 8

Allows for efficient data processing and storage.

Package Shape: SQUARE

Saves space on PCB and provides a neat layout.

Bit Size: 16

Offers higher data processing capabilities compared to lower bit sizes.

No. of Terminals: 64

Sufficient for various external connections and interfaces.

Minimum Supply Voltage: 1.8 V

Can operate at lower voltages for energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where high temperatures may be encountered.

CPU Family: MSP430

A well-known and reliable CPU family for microcontrollers.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold environments.

ADC Channels: YES

Allows for analog to digital conversion, enabling sensor integration.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient RISC architecture for optimized performance.

No. of Timers: 2

Provides timing and counting functions for various applications.

ROM Bytes: 2048

Adequate program memory for storing firmware and code.

Technical Specifications

Microcontrollers MSP430A064IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE DURING FLASH MEMORY PROGRAMMING IS 2.7V-3.6V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART, USART(2)

Peripherals:

COMPARATOR, POR, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430A064IPM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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