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MSP430A024IPM

Texas Instruments

MSP430A024IPM by Texas Instruments

MSP430A024IPM by Texas Instruments is a 16-bit microcontroller with 48 I/O lines, 8 MHz clock frequency, and 2 KB RAM. Ideal for industrial applications, it features 8-channel ADC, low power mode, and peripherals like comparator and timers. With SPI, UART, and USART connectivity options, this CMOS technology-based MCU offers versatile performance in a compact package.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,076 parts In-Stock

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Digiode

USA . 1,102 parts In-Stock

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One Stop Electronics

USA . 486 parts In-Stock

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$13.000

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486

$13.000

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AZTECH Wire

Italy . 236 parts In-Stock

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$16.033

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Parana Technologies

USA . 2,221 parts In-Stock

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$54.021

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DigiPath Technology Company

USA . 273 parts In-Stock

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$59.484

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ChromeModa Solutions

Germany . 1,114 parts In-Stock

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$60.698

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$49.772

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IDEA Electronic Components Group

UK . 331 parts In-Stock

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$60.698

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$57.663

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$54.628

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Corphita

USA . 4,733 parts In-Stock

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Overview

Unlock the potential of your projects with the Texas Instruments MSP430A024IPM microcontroller. Designed with precision and reliability in mind, this versatile device offers a wide range of applications in various industries. With its low power consumption and advanced features such as ADC channels, PWM channels, and connectivity options like SPI and UART, this microcontroller provides exceptional value and performance. Trust Texas Instruments for superior quality and innovation, and take your projects to the next level with the MSP430A024IPM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material makes the package durable and resistant to heat and moisture, ensuring longevity and reliability of the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of applications.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high efficiency, making it ideal for battery-powered applications.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates to the microcontroller's firmware, ensuring adaptability to changing requirements.

Analog To Digital Converters: 8-Ch 12-Bit

Having multiple ADC channels with high resolution enables accurate and efficient analog signal processing, suitable for various sensor interfacing applications.

No. of I/O Lines: 48

The large number of I/O lines provide ample connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers MSP430A024IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE DURING FLASH MEMORY PROGRAMMING IS 2.7V-3.6V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART, USART(2)

Peripherals:

COMPARATOR, POR, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430A024IPM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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