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MSP430A018IPN

Texas Instruments

MSP430A018IPN by Texas Instruments

MSP430A018IPN by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at a max frequency of 8 MHz. It features DAC, ADC, and PWM channels suitable for industrial applications requiring low power consumption. With a temperature range from -40 to 85°C, it offers versatile performance in compact dimensions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,974 parts In-Stock

1+ parts

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7,974

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Digiode

USA . 2,772 parts In-Stock

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2,772

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,125 parts In-Stock

1+ parts

$16.000

100+ parts

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1,125

$16.000

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AZTECH Wire

Italy . 575 parts In-Stock

1+ parts

$16.453

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575

$16.453

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Parana Technologies

USA . 2,157 parts In-Stock

1+ parts

$76.475

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2,157

$76.475

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DigiPath Technology Company

USA . 2,257 parts In-Stock

1+ parts

$84.208

100+ parts

$77.472

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2,257

$84.208

$77.472

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ChromeModa Solutions

Germany . 4,388 parts In-Stock

1+ parts

$85.927

100+ parts

$70.460

1k+ parts

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4,388

$85.927

$70.460

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IDEA Electronic Components Group

UK . 378 parts In-Stock

1+ parts

$85.927

100+ parts

$81.631

1k+ parts

$77.334

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378

$85.927

$81.631

$77.334

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Corphita

USA . 3,877 parts In-Stock

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Overview

Discover the innovative MSP430A018IPN microcontroller by Texas Instruments, a leading manufacturer in the industry. This powerful device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this product delivers exceptional value with its advanced features, efficient power management, and versatile design. Trust Texas Instruments to provide cutting-edge solutions that meet your needs and exceed your expectations. Choose the MSP430A018IPN for superior quality and unmatched performance in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6V

Ability to handle a maximum supply voltage of 3.6V provides flexibility in power supply options for the microcontroller.

Package Shape: SQUARE

Square package shape helps in easy placement and alignment on the circuit board, aiding in efficient design layouts.

Bit Size: 16

16-bit processing capability enables the microcontroller to handle complex tasks and calculations efficiently.

DAC Channels: YES

DAC channels allow the microcontroller to output analog signals, making it suitable for applications requiring analog voltage outputs.

Power Supplies (V): 1.8/3.3

Support for multiple power supply voltages (1.8V and 3.3V) offers flexibility in powering the microcontroller according to the application requirements.

No. of Terminals: 80

Having 80 terminals provides connectivity options for various input/output devices and peripherals, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style helps in compact design integration and minimizes the overall footprint of the microcontroller on the circuit board.

Minimum Supply Voltage: 1.8V

Capability to operate at a minimum supply voltage of 1.8V ensures efficient power consumption and operation of the microcontroller in low-power scenarios.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures up to 85°C makes the microcontroller suitable for industrial applications where temperature variations are common.

CPU Family: MSP430

Belonging to the MSP430 CPU family ensures reliable performance and compatibility with existing MSP430-based systems and software.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40°C enables the microcontroller to function in extreme cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for the microcontroller.

ADC Channels: YES

ADC channels allow the microcontroller to convert analog signals into digital data, expanding its capabilities in interfacing with sensors and other analog devices.

DMA Channels: YES

DMA channels enable direct memory access for efficient data transfers, reducing the load on the CPU and improving overall system performance.

Terminal Position: QUAD

Quad terminal position provides stable mechanical support and reliable connectivity, enhancing the durability and longevity of the microcontroller.

Maximum Seated Height: 1.6mm

Low seated height of 1.6mm minimizes the overall profile of the microcontroller, making it suitable for compact designs with space constraints.

Width: 12mm

With a width of 12mm, the microcontroller can be easily accommodated in various design layouts without occupying excessive space.

Maximum Clock Frequency: 8MHz

Operating at a maximum clock frequency of 8MHz enables fast processing speed and real-time responsiveness for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

Sustaining peak reflow temperature for 30 seconds ensures proper soldering and assembly of the microcontroller onto the circuit board without any overheating issues.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microcontroller can withstand high-temperature soldering processes without compromising functionality.

Length: 12mm

Measuring 12mm in length, the microcontroller offers a balanced form factor for easy integration and placement within compact electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification ensures reliable performance and durability of the microcontroller in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with RISC architecture, it offers efficient processing capabilities, reduced power consumption, and faster execution of instructions.

Technology: CMOS

CMOS technology used in the microcontroller provides low power consumption, high noise immunity, and compatibility with various digital and analog circuits.

Terminal Form: GULL WING

Gull wing terminal form ensures secure soldering connections and mechanical stability, enhancing the reliability and longevity of the microcontroller in operation.

Nominal Supply Voltage: 2.2V

Operating at a nominal supply voltage of 2.2V ensures consistent and stable power delivery to the microcontroller for reliable performance across different operating conditions.

PWM Channels: YES

PWM channels allow the microcontroller to generate pulse-width modulated signals, enabling precise control of output signals and devices for various applications.

ROM Programmability: FLASH

ROM programmability using flash technology enables easy firmware updates and reprogramming of the microcontroller without the need for external programming equipment or additional components.

Terminal Pitch: 0.5mm

Fine terminal pitch of 0.5mm facilitates high-density mounting and precise soldering of the microcontroller onto the PCB, enhancing manufacturing efficiency.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller can withstand exposure to moderate moisture levels during storage and assembly processes, ensuring long-term reliability.

Speed: 8rpm

Operating at a rotational speed of 8rpm, the microcontroller can efficiently process instructions and perform tasks with reduced latency and improved response times.

No. of I/O Lines: 48

Having 48 I/O lines provides ample connectivity options for interfacing with external devices, sensors, and peripherals, allowing for versatile and expansive system integration.

Technical Specifications

Microcontrollers MSP430A018IPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

MSP430A018IPN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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