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MC3452J

Texas Instruments

MC3452J by Texas Instruments

MC3452J by Texas Instruments is a Line Driver & Receiver with +-5V power supplies, 16 terminals, and 25ns max receive delay. It operates in commercial temperature range and uses bipolar technology. Ideal for applications requiring high-speed signal transmission in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

6,075

-

-

-

-

Digiode

USA . 2,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,900

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 634 parts In-Stock

1+ parts

$6.397

100+ parts

-

1k+ parts

-

10k+ parts

-

634

$6.397

-

-

-

One Stop Electronics

USA . 696 parts In-Stock

1+ parts

$8.500

100+ parts

-

1k+ parts

-

10k+ parts

-

696

$8.500

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-

-

Parana Technologies

USA . 1,114 parts In-Stock

1+ parts

$13.337

100+ parts

-

1k+ parts

$13.849

10k+ parts

-

1,114

$13.337

-

$13.849

-

ChromeModa Solutions

Germany . 3,712 parts In-Stock

1+ parts

$14.985

100+ parts

$12.288

1k+ parts

-

10k+ parts

-

3,712

$14.985

$12.288

-

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IDEA Electronic Components Group

UK . 1,356 parts In-Stock

1+ parts

$14.985

100+ parts

$14.236

1k+ parts

$13.486

10k+ parts

-

1,356

$14.985

$14.236

$13.486

-

Corphita

USA . 3,229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,229

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-

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DigiPath Technology Company

USA . 2,355 parts In-Stock

1+ parts

-

100+ parts

$13.510

1k+ parts

-

10k+ parts

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2,355

-

$13.510

-

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Overview

Upgrade your electronics with the MC3452J line driver and receiver from Texas Instruments. Crafted with top-of-the-line ceramic materials, this versatile component offers reliable performance in a range of applications. From enhancing signal strength to improving data transmission, the MC3452J is designed to deliver high-quality results every time. Trust Texas Instruments’ reputation for excellence and choose the MC3452J for all your line driver and receiver needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides excellent thermal and electrical insulation, ensuring reliable and stable operation.

Power Supplies (V): +-5

Wide power supply range allows for flexibility in different voltage applications.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures the product can withstand elevated temperatures without performance degradation.

Technology: BIPOLAR

Bipolar technology provides robust performance and high-speed operation, making it suitable for a wide range of applications.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration and compatibility with various PCB designs.

Technical Specifications

Line Drivers & Receivers MC3452J attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Nominal Negative Supply Voltage:

-5 V

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Low Current:

16 Amp

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Receive Delay:

25 ns

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

60 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

MC3452J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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