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MC3450DR

Texas Instruments

MC3450DR by Texas Instruments

MC3450DR by Texas Instruments is a Line Receiver IC with 4 functions, operating at -5V to +5V. It has 14 terminals, operates b/w 0-70°C, and offers a max output low current of 16A. Ideal for applications requiring differential input characteristics and fast signal reception with a max delay of 25ns.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,010 parts In-Stock

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2,010

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Digiode

USA . 708 parts In-Stock

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708

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,850 parts In-Stock

1+ parts

$2.644

100+ parts

-

1k+ parts

$3.134

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1,850

$2.644

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$3.134

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DigiPath Technology Company

USA . 1,316 parts In-Stock

1+ parts

$2.912

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1,316

$2.912

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IDEA Electronic Components Group

UK . 1,221 parts In-Stock

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$2.971

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$2.674

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$2.971

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$2.674

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ChromeModa Solutions

Germany . 317 parts In-Stock

1+ parts

$2.971

100+ parts

$2.436

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317

$2.971

$2.436

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AZTECH Wire

Italy . 649 parts In-Stock

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$17.199

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649

$17.199

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One Stop Electronics

USA . 1,312 parts In-Stock

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$24.500

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1,312

$24.500

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Corphita

USA . 4,427 parts In-Stock

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Overview

Enhance your electronic designs with the MC3450DR from Texas Instruments, a top-tier manufacturer known for quality products. This line driver and receiver is versatile and reliable, making it ideal for a wide range of applications. With its compact design and high performance, this product offers outstanding value to customers looking for seamless connectivity and efficient signal transmission. Upgrade your projects today with the MC3450DR and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and making installation simpler.

Maximum Supply Voltage: 5.5 V

Suitable for a wide range of applications without risk of damage from higher voltages.

No. of Functions: 4

Offers multiple functions in a single component, reducing the need for additional components and simplifying circuit design.

Package Shape: RECTANGULAR

Easily fits into standard circuit board layouts for seamless integration.

Power Supplies (V): +-5

Provides balanced power supplies for optimum performance and reliability.

No. of Terminals: 14

Offers ample connectivity options for versatile applications.

Package Style (Meter): SMALL OUTLINE

Saves space on the circuit board and allows for efficient use of available area.

Minimum Supply Voltage: 4.5 V

Works efficiently with lower supply voltages, making it suitable for a variety of power sources.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, ensuring reliable operation in various environments.

Minimum Operating Temperature: 0 °C

Operates effectively even in low-temperature conditions, expanding its usability.

Terminal Position: DUAL

Allows for flexibility in connecting the component within the circuit.

Maximum Seated Height: 1.75 mm

Low profile design enables compact arrangements on circuit boards.

Width: 3.9 mm

Narrow width for efficient use of space on the circuit board.

Maximum Output Low Current: 16 Amp

High output current capacity for reliable signal transmission.

Receiver No. of Bits: 4

Suitable for applications requiring 4-bit signal reception.

Length: 8.65 mm

Compact length for space-saving installation.

Temperature Grade: COMMERCIAL

Meets commercial standards for reliability and performance.

Maximum Receive Delay: 25 ns

Low receive delay for quick signal transmission and response.

Technology: BIPOLAR

Utilizes bipolar technology for efficient signal processing.

Terminal Form: GULL WING

Gull-wing terminals for easy soldering and secure connections.

Maximum Supply Current: 60 mA

Moderate supply current requirement for efficient power consumption.

Input Characteristics: DIFFERENTIAL

Differential input for noise immunity and reliable signal reception.

Nominal Supply Voltage: 5 V

Nominal supply voltage for stable operation within standard voltage ranges.

Nominal Negative Supply Voltage: -5 V

Provides negative supply voltage for balanced power distribution.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common circuit board layouts.

Interface IC Type: LINE RECEIVER

Specifically designed for line receiver applications, ensuring high performance and reliability.

Technical Specifications

Line Drivers & Receivers MC3450DR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

4

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Low Current:

16 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Receive Delay:

25 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

MC3450DR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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