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MAX3243CDBRE4

Texas Instruments

MAX3243CDBRE4 by Texas Instruments

MAX3243CDBRE4 by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3.6V. It has a transmit delay of 150ns and supports supply voltages of 3.3/5V. Ideal for EIA-232-F, TIA-232-F, V.28 interfaces in commercial temperature applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,555 parts In-Stock

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4,555

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Digiode

USA . 131 parts In-Stock

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131

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Bristol Electronics

USA . 8 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 525 parts In-Stock

1+ parts

$3.161

100+ parts

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525

$3.161

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Parana Technologies

USA . 1,163 parts In-Stock

1+ parts

$7.254

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$7.756

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$7.254

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$7.756

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IDEA Electronic Components Group

UK . 1,675 parts In-Stock

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$8.150

100+ parts

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$7.335

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$8.150

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$7.335

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ChromeModa Solutions

Germany . 482 parts In-Stock

1+ parts

$8.150

100+ parts

$6.683

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482

$8.150

$6.683

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Ampacity Inc.

Singapore . 1,475 parts In-Stock

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$8.500

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$8.500

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One Stop Electronics

USA . 1,129 parts In-Stock

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$11.500

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$11.500

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AZTECH Wire

Italy . 784 parts In-Stock

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$18.905

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$18.905

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iodParts Technologies Inc.

India . 14,487 parts In-Stock

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Continental Prestige Electronics

USA . 4,868 parts In-Stock

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Argo Parts USA

USA . 4,538 parts In-Stock

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Glotronic Ltd.

UK . 4,100 parts In-Stock

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Microchip USA

USA . 2,770 parts In-Stock

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DigiPath Technology Company

USA . 809 parts In-Stock

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$7.348

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809

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$7.348

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Corphita

USA . 599 parts In-Stock

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599

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Enhance your communication systems with the MAX3243CDBRE4 by Texas Instruments, a premium line driver and receiver that guarantees top-notch quality and reliability. Manufactured by industry leader Texas Instruments, this product offers unparalleled performance in various applications. Its advanced features and cutting-edge technology ensure seamless data transmission and reception. Upgrade your systems today and experience the value and benefits that only Texas Instruments can provide. Trust in the MAX3243CDBRE4 for all your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures longevity and reliability of the product.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product is compatible with a wide range of power sources.

No. of Functions: 3

The multiple functions provided by this product offer versatility and flexibility in various applications.

Package Shape: RECTANGULAR

The rectangular package shape helps in efficient space utilization on the circuit board.

Maximum Transmit Delay: 150 ns

The low transmit delay ensures quick and efficient data transmission.

Power Supplies (V): 3.3/5

The compatibility with multiple power supplies means greater flexibility in use.

No. of Terminals: 28

The high number of terminals allows for multiple connections and complex configurations.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finish ensures reliable electrical connections.

Maximum Output Low Current: 0.001 Amp

The low output current helps in reducing power consumption and heat generation.

Technical Specifications

Line Drivers & Receivers MAX3243CDBRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE WITH 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

5 V

Maximum Output Low Current:

.001 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

150 ns

Width:

5.3 mm

Trade Compliance

MAX3243CDBRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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