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MAX3223ECDB

Texas Instruments

MAX3223ECDB by Texas Instruments

MAX3223ECDB by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3/5V. It features inverted output polarity, Schmitt trigger input characteristics, and EIA-232-F interface standard. Ideal for applications requiring reliable communication over short distances in commercial temperature environments.

Median Price

$2.025

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 320 parts In-Stock

1+ parts

$3.240

100+ parts

$2.053

1k+ parts

$1.886

10k+ parts

-

320

$3.240

$2.053

$1.886

-

Rochester

USA . 965 parts In-Stock

1+ parts

-

100+ parts

$1.810

1k+ parts

$1.620

10k+ parts

$1.530

965

-

$1.810

$1.620

$1.530

Verical

USA . 814 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.025

10k+ parts

$1.913

814

-

-

$2.025

$1.913

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,327 parts In-Stock

1+ parts

$1.662

100+ parts

-

1k+ parts

-

10k+ parts

-

3,327

$1.662

-

-

-

Vyrian

USA . 8,793 parts In-Stock

1+ parts

-

100+ parts

-

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8,793

-

-

-

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DigiKey Marketplace

USA . 974 parts In-Stock

1+ parts

-

100+ parts

-

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974

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-

-

-

Inventory MP

USA . 101 parts In-Stock

1+ parts

-

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101

-

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Bristol Electronics

USA . 101 parts In-Stock

1+ parts

-

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-

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101

-

-

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PC Components Company LLC

USA . 23 parts In-Stock

1+ parts

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23

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Prism Electronics

USA . 17 parts In-Stock

1+ parts

-

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17

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,522 parts In-Stock

1+ parts

$1.575

100+ parts

-

1k+ parts

-

10k+ parts

-

1,522

$1.575

-

-

-

Parana Technologies

USA . 669 parts In-Stock

1+ parts

$12.646

100+ parts

-

1k+ parts

$13.108

10k+ parts

-

669

$12.646

-

$13.108

-

Microchip USA

USA . 342 parts In-Stock

1+ parts

$12.940

100+ parts

$12.900

1k+ parts

$12.900

10k+ parts

$12.860

342

$12.940

$12.900

$12.900

$12.860

DigiPath Technology Company

USA . 798 parts In-Stock

1+ parts

$13.925

100+ parts

$12.811

1k+ parts

-

10k+ parts

-

798

$13.925

$12.811

-

-

IDEA Electronic Components Group

UK . 1,524 parts In-Stock

1+ parts

$14.209

100+ parts

$13.499

1k+ parts

$12.788

10k+ parts

-

1,524

$14.209

$13.499

$12.788

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ChromeModa Solutions

Germany . 304 parts In-Stock

1+ parts

$14.209

100+ parts

$11.651

1k+ parts

-

10k+ parts

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304

$14.209

$11.651

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-

Perfect Parts

USA . 1,081 parts In-Stock

1+ parts

-

100+ parts

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1,081

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-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

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Overview

Elevate your communication systems with the MAX3223ECDB by Texas Instruments, a top-of-the-line Line Driver & Receiver that guarantees unparalleled quality and reliability. Designed using cutting-edge technology, this product is perfect for a wide range of applications. Experience seamless data transmission, enhanced performance, and ultimate peace of mind with Texas Instruments' reputation for excellence. Upgrade your systems today and discover the value and benefits that the MAX3223ECDB brings to your business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the line driver and receiver, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 2

Having multiple functions in one component increases efficiency and saves space in the circuit design.

Maximum Operating Temperature: 70 °C

Can operate efficiently in high-temperature environments, ensuring reliable performance under varying conditions.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliance with industry standards ensures compatibility and interoperability with other communication devices.

Technical Specifications

Line Drivers & Receivers MAX3223ECDB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

MAX3223ECDB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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