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MAX3221IDBG4

Texas Instruments

MAX3221IDBG4 by Texas Instruments

MAX3221IDBG4 by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at 3.3/5 V power supplies. It features a CMOS technology interface supporting EIA-232-F, TIA-232-F, and V.28 standards. Ideal for industrial applications requiring a max supply voltage of 5.5 V and an operating temperature range from -40 to 85°C.

Median Price

$1.330

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$1.330

1k+ parts

$1.100

10k+ parts

$0.984

60

-

$1.330

$1.100

$0.984

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,008 parts In-Stock

1+ parts

$1.150

100+ parts

-

1k+ parts

-

10k+ parts

-

3,008

$1.150

-

-

-

Component Electronics Inc.

Canada . 12 parts In-Stock

1+ parts

$1.540

100+ parts

$1.150

1k+ parts

$1.000

10k+ parts

-

12

$1.540

$1.150

$1.000

-

Chip Stock

USA . 10,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,540

-

-

-

-

Vyrian

USA . 4,064 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,064

-

-

-

-

LIBRA Elektronik GmbH

Germany . 80 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

80

-

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 60 parts In-Stock

1+ parts

$1.030

100+ parts

-

1k+ parts

-

10k+ parts

-

60

$1.030

-

-

-

Corphita

USA . 429 parts In-Stock

1+ parts

$1.089

100+ parts

-

1k+ parts

-

10k+ parts

-

429

$1.089

-

-

-

Vigor

Singapore . 4,055 parts In-Stock

1+ parts

$1.140

100+ parts

-

1k+ parts

-

10k+ parts

-

4,055

$1.140

-

-

-

AZTECH Wire

Italy . 592 parts In-Stock

1+ parts

$6.309

100+ parts

-

1k+ parts

-

10k+ parts

-

592

$6.309

-

-

-

Parana Technologies

USA . 2,341 parts In-Stock

1+ parts

$10.953

100+ parts

-

1k+ parts

$11.417

10k+ parts

-

2,341

$10.953

-

$11.417

-

DigiPath Technology Company

USA . 2,162 parts In-Stock

1+ parts

$12.061

100+ parts

-

1k+ parts

-

10k+ parts

-

2,162

$12.061

-

-

-

ChromeModa Solutions

Germany . 2,185 parts In-Stock

1+ parts

$12.307

100+ parts

$10.092

1k+ parts

-

10k+ parts

-

2,185

$12.307

$10.092

-

-

IDEA Electronic Components Group

UK . 50 parts In-Stock

1+ parts

$12.307

100+ parts

$11.692

1k+ parts

$11.076

10k+ parts

-

50

$12.307

$11.692

$11.076

-

QUARKTWIN TECHNOLOGY LTD

USA . 8,318 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,318

-

-

-

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Microchip USA

USA . 6,849 parts In-Stock

1+ parts

-

100+ parts

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6,849

-

-

-

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Continental Prestige Electronics

USA . 2,167 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,167

-

-

-

-

Argo Parts USA

USA . 1,160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,160

-

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50

-

-

-

-

Overview

Unlock seamless communication with the MAX3221IDBG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Line Drivers & Receivers that guarantee reliability and performance. Perfect for a wide range of applications, this product offers customers unmatched value and benefits. Experience the advantages of smooth data transmission, robust construction, and versatile compatibility. Choose Texas Instruments for cutting-edge technology that elevates your connectivity solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology makes it easier to integrate the line driver/receiver into compact electronic devices and PCB designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V allows the line driver/receiver to operate efficiently under various voltage conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this line driver/receiver can withstand high temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the line driver/receiver can function reliably in cold environments.

Technical Specifications

Line Drivers & Receivers MAX3221IDBG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATE WITH 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

1

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

.001 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

1

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

MAX3221IDBG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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