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MAX3221EIPWG4

Texas Instruments

MAX3221EIPWG4 by Texas Instruments

MAX3221EIPWG4 by Texas Instruments is a Line Driver & Receiver with 16 terminals, operating at 3.3/5V. It has a max supply voltage of 3.6V and can handle industrial temperatures from -40 to 85°C. Ideal for EIA-232-F, TIA-232-F, V.28 interfaces due to its Schmitt trigger input characteristics and inverted output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,375 parts In-Stock

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8,375

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Digiode

USA . 1,885 parts In-Stock

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1,885

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LIBRA Elektronik GmbH

Germany . 45 parts In-Stock

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45

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Semi Source

USA . 27 parts In-Stock

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Nova Conductors

Japan . 19 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 2,500 parts In-Stock

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$1.200

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2,500

$1.200

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Parana Technologies

USA . 823 parts In-Stock

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$7.333

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-

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$7.825

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823

$7.333

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$7.825

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Corohmni

South Africa . 117 parts In-Stock

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$7.561

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117

$7.561

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DigiPath Technology Company

USA . 1,840 parts In-Stock

1+ parts

$8.074

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$7.428

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1,840

$8.074

$7.428

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ChromeModa Solutions

Germany . 6,284 parts In-Stock

1+ parts

$8.239

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$6.756

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6,284

$8.239

$6.756

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IDEA Electronic Components Group

UK . 678 parts In-Stock

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$8.239

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$7.415

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678

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AZTECH Wire

Italy . 616 parts In-Stock

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$11.004

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616

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One Stop Electronics

USA . 881 parts In-Stock

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$20.500

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$20.500

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Semicontronic

India . 1,327 parts In-Stock

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$21.500

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$20.962

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$20.855

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1,327

$21.500

$20.962

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Ampacity Inc.

Singapore . 338 parts In-Stock

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$49.500

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338

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Argo Parts USA

USA . 4,296 parts In-Stock

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Corphita

USA . 4,228 parts In-Stock

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Microchip USA

USA . 475 parts In-Stock

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475

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Enhance your communication systems with the MAX3221EIPWG4 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments offers a wide range of components that excel in performance. The MAX3221EIPWG4, belonging to the Line Drivers & Receivers category, is no exception. With its small outline, thin profile package style and nickel palladium gold terminal finish, this product delivers seamless data transmission. Whether used in industrial settings or consumer electronics, customers can trust this line transceiver to provide efficient and accurate results. Upgrade your applications today with the MAX3221EIPWG4 and experience the benefits firsthand.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the internal components, making it a reliable choice for long-term use.

Surface Mount:

YES - Allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage:

3.6 V - Offers a wide operating voltage range, making it versatile and compatible with various systems.

Package Shape:

RECTANGULAR - Provides a compact design that optimizes space on the circuit board, ideal for tight installations.

Power Supplies (V):

3.3/5 - Supports multiple power supply options, giving flexibility in different operating environments.

No. of Terminals:

16 - Provides multiple connection points for input and output signals, enabling versatile connectivity options.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Offers a sleek and space-saving design that is suitable for compact electronic devices.

Minimum Supply Voltage:

3 V - Allows for operation in low voltage conditions, ensuring consistent performance in various power scenarios.

Maximum High Level Input Current:

0.000001 Amp - Provides efficient power consumption, resulting in energy savings and reduced heat generation.

Minimum Operating Temperature:

40 °C - Performs reliably in extreme temperature conditions, suitable for harsh environments.

Terminal Finish:

NICKEL PALLADIUM GOLD - Ensures reliable connections and prevents corrosion, prolonging the product's lifespan.

Maximum Seated Height:

1.2 mm - Offers a low-profile design, ideal for applications with limited vertical space.

Width:

4.4 mm - Provides a compact footprint, suitable for compact electronic devices or densely populated circuits.

Maximum Output Low Current:

1.6 Amp - Allows for driving high-power loads, making it suitable for applications requiring robust output capabilities.

Output Polarity:

INVERTED - Supports inverted output signals, ideal for applications requiring signal inversion.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures reliable soldering during assembly, reducing the risk of solder joint failure.

Peak Reflow Temperature °C:

260 - Supports high-temperature reflow soldering processes, ensuring proper solder connections.

Length:

5 mm - Offers a compact length, suitable for space-constrained applications.

Maximum Receive Delay:

150 ns - Provides fast signal reception, enabling real-time data transmission and response.

Terminal Form:

GULL WING - Facilitates easy installation and secure connections on the circuit board, enhancing reliability.

Interface Standard:

EIA-232-F; TIA-232-F; V.28 - Complies with industry standards, ensuring compatibility with a wide range of devices and systems.

Maximum Supply Current:

0.01 mA - Supports low power consumption, suitable for battery-powered applications or energy-efficient systems.

Input Characteristics:

SCHMITT TRIGGER - Offers noise immunity and stable signal processing, ensuring reliable performance in noisy environments.

Nominal Supply Voltage:

3.3 V - Provides a stable operating voltage, ensuring consistent performance in various operating conditions.

Terminal Pitch:

0.65 mm - Provides a standard terminal spacing, facilitating easy integration with other components on the circuit board.

Interface IC Type:

LINE TRANSCEIVER - Enables signal transmission and reception between different systems or devices, making it suitable for communication applications.

Technical Specifications

Line Drivers & Receivers MAX3221EIPWG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

1

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

.01 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

MAX3221EIPWG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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