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MAX211IDBRE4

Texas Instruments

MAX211IDBRE4 by Texas Instruments

MAX211IDBRE4 by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at 5V. It features a small outline package, Schmitt trigger input characteristics, and EIA-232-F interface standard. Ideal for industrial applications requiring reliable data transmission over short distances.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 14,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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14,500

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Digiode

USA . 4,823 parts In-Stock

1+ parts

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1k+ parts

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4,823

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Vyrian

USA . 2,344 parts In-Stock

1+ parts

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2,344

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 598 parts In-Stock

1+ parts

$7.387

100+ parts

-

1k+ parts

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598

$7.387

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Parana Technologies

USA . 2,296 parts In-Stock

1+ parts

$9.988

100+ parts

-

1k+ parts

$10.551

10k+ parts

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2,296

$9.988

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$10.551

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DigiPath Technology Company

USA . 1,413 parts In-Stock

1+ parts

$10.999

100+ parts

$10.119

1k+ parts

-

10k+ parts

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1,413

$10.999

$10.119

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ChromeModa Solutions

Germany . 4,324 parts In-Stock

1+ parts

$11.223

100+ parts

$9.203

1k+ parts

-

10k+ parts

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4,324

$11.223

$9.203

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IDEA Electronic Components Group

UK . 1,978 parts In-Stock

1+ parts

$11.223

100+ parts

$10.662

1k+ parts

$10.101

10k+ parts

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1,978

$11.223

$10.662

$10.101

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One Stop Electronics

USA . 309 parts In-Stock

1+ parts

$47.500

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309

$47.500

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Microchip USA

USA . 2,964 parts In-Stock

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2,964

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Corphita

USA . 1,669 parts In-Stock

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1,669

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Overview

Elevate your communication systems with the MAX211IDBRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality line drivers & receivers that exceed expectations. This versatile product offers customers unmatched reliability and performance, making it perfect for a wide range of applications. Experience seamless connectivity and superior signal transmission with the MAX211IDBRE4 - the ultimate solution for all your communication needs. Choose Texas Instruments for excellence you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy installation on PCBs, saving space and enabling efficient manufacturing processes.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, the product can handle a wide range of power sources, providing flexibility in different operating conditions.

No. of Functions: 4

Having multiple functions in one device simplifies the design and integration process, reducing the number of components needed in a system.

Package Shape: RECTANGULAR

The rectangular package shape is common and easy to handle during assembly, making it compatible with standard manufacturing processes.

Power Supplies (V): 5

Operating at 5V ensures compatibility with a wide range of systems and devices, making it a versatile choice for various applications.

No. of Terminals: 28

Having a high number of terminals provides ample connectivity options and flexibility in interfacing with other components or devices.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage allows for efficient power management and can operate in environments where power sources may fluctuate.

Maximum High Level Input Current: 0.0002 Amp

With a low high-level input current, the product consumes minimal power, making it energy-efficient and suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability in harsh environmental conditions, making it suitable for industrial settings.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, the product can withstand extreme cold environments, enhancing its versatility in varied applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish provides excellent corrosion resistance and ensures reliable connections for long-term performance.

Terminal Position: DUAL

Dual terminal positions offer redundancy and flexibility in connection options, enabling robust and reliable signal transmission.

Maximum Seated Height: 2 mm

The low seated height allows for compact designs and efficient use of space in compact electronic devices.

Width: 5.3 mm

The narrow width makes the product suitable for applications where space is limited, offering a compact and efficient solution.

Maximum Output Low Current: 1.6 Amp

With a high maximum output low current, the product can drive demanding loads, offering excellent performance and reliability.

Receiver No. of Bits: 5

Having 5 bits in the receiver ensures accurate data reception and processing, making the product suitable for high-speed communication applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for efficient soldering processes during assembly, ensuring reliable connections and longevity of the product.

Length: 10.2 mm

The compact length of the product makes it suitable for space-constrained applications, offering a versatile and efficient solution.

Minimum Out Swing: 10 V

The minimum output swing of 10V ensures strong signal integrity and reliability in data transmission, making it suitable for demanding communication systems.

Temperature Grade: INDUSTRIAL

Being industrial-grade, the product can withstand rugged conditions and harsh environments, ensuring reliable performance in demanding applications.

Maximum Receive Delay: 1000 ns

With a low maximum receive delay, the product offers real-time data transmission, making it ideal for time-sensitive applications.

Terminal Form: GULL WING

The gull-wing terminal form simplifies the soldering process and ensures secure connections, enhancing the product's reliability and ease of assembly.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compatibility with multiple interface standards allows for seamless integration with existing systems and devices, enhancing interoperability and versatility.

Maximum Supply Current: 20 mA

With a low maximum supply current, the product operates efficiently and consumes minimal power, making it suitable for energy-conscious applications.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics provide hysteresis and noise immunity, ensuring reliable signal reception and processing in noisy environments.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, simplifying system design and integration.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm allows for high-density mounting, enabling compact and space-efficient PCB designs.

Driver No. of Bits: 4

Having 4 bits in the driver enables accurate and precise signal transmission, making the product suitable for applications requiring high data integrity.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver, the product can both transmit and receive data, offering a comprehensive solution for communication applications.

Technical Specifications

Line Drivers & Receivers MAX211IDBRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

4

Maximum High Level Input Current:

.0002 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

1000 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

MAX211IDBRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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