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MAX211CDBR

Texas Instruments

MAX211CDBR by Texas Instruments

MAX211CDBR by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at 5V. It features a small outline package, Schmitt trigger input characteristics, and supports EIA-232-F interface standard. Ideal for commercial applications requiring reliable data transmission in temperature range of 0-70°C.

Median Price

$1.260

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 10,000 parts In-Stock

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Mouser Electronics

USA . 850 parts In-Stock

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$1.260

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Semi Source

USA . 7,319 parts In-Stock

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Digiode

USA . 4,531 parts In-Stock

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Vyrian

USA . 3,936 parts In-Stock

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Chip Stock

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Connector Distribution Corp

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Right Parts Inc.

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Prism Electronics

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Parana Technologies

USA . 1,935 parts In-Stock

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$10.703

100+ parts

$993.949

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$9.633

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$9.633

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DigiPath Technology Company

USA . 600 parts In-Stock

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$11.785

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$10.843

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$11.785

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ChromeModa Solutions

Germany . 4,186 parts In-Stock

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$12.026

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$9.861

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$12.026

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IDEA Electronic Components Group

UK . 1,417 parts In-Stock

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$12.026

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Perfect Parts

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Lixinc

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GreenTree Electronics

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Authorized Procurement Solutions

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Corphita

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Kepictronics

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A-Z Elektronik GmbH

Germany . 1,704 parts In-Stock

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Overview

Discover the MAX211CDBR by Texas Instruments, a top-of-the-line line driver and receiver that guarantees quality and reliability. With its cutting-edge technology and durable construction, this product is perfect for a wide range of applications. From industrial automation to telecommunications, the MAX211CDBR delivers exceptional performance and efficiency. Trust Texas Instruments to provide you with the best in electronic components, and experience the value and benefits that this product brings to your projects. Unlock new possibilities with the MAX211CDBR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, ensuring a long lifespan for the product.

Surface Mount: YES

Enables easy installation and space-saving design, ideal for modern electronic applications.

Maximum Supply Voltage: 5.5 V

Supports a wide range of voltage inputs, making it versatile for different power supply setups.

No. of Functions: 4

Offers multiple functions in a single device, providing cost-effectiveness and efficiency.

Maximum Supply Voltage-1: 5.5 V

Ensures stable performance within the specified voltage range for reliable operation.

Power Supplies (V): 5

Operates efficiently with a standard power supply voltage commonly used in electronic systems.

No. of Terminals: 28

Provides ample connectivity options for various input and output configurations.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact design allows for high packing density on a circuit board, optimizing space usage.

Minimum Supply Voltage-1: 4.5 V

Ensures compatibility with lower voltage requirements while maintaining performance standards.

Maximum High Level Input Current: 0.0002 Amp

Ensures efficient signal transmission without overloading the input circuitry.

Minimum Operating Temperature: 0 °C

Can operate in a wide temperature range, suitable for diverse environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity, corrosion resistance, and durability for long-term reliability.

Maximum Output Low Current: 1.6 Amp

Delivers sufficient current capacity for driving output signals without voltage drops.

Receiver No. of Bits: 5

Supports reliable data reception with high precision and accuracy.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes for secure attachment to the circuit board.

Minimum Out Swing: 10 V

Provides a wide output voltage swing, suitable for driving various loads with different voltage requirements.

Temperature Grade: COMMERCIAL

Designed for use in standard commercial applications, ensuring compatibility with typical operating conditions.

Maximum Receive Delay: 1000 ns

Supports fast data transmission and reception with minimal delays for efficient communication.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Complies with industry communication standards for seamless integration into existing systems.

Maximum Supply Current: 20 mA

Operates with low power consumption, minimizing energy costs and heat generation.

Interface IC Type: LINE TRANSCEIVER

Facilitates bidirectional data transmission between different protocols or systems, enhancing connectivity options.

Technical Specifications

Line Drivers & Receivers MAX211CDBR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

4

Maximum High Level Input Current:

.0002 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

1000 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

MAX211CDBR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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