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MAX208CDBRG4

Texas Instruments

MAX208CDBRG4 by Texas Instruments

MAX208CDBRG4 by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at 5V. It features a max transmit delay of 10000ns and can handle high level input current up to 0.0002A. Ideal for EIA-232-F, TIA-232-F, V.28 interfaces in commercial temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,596 parts In-Stock

1+ parts

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4,596

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Vyrian

USA . 3,620 parts In-Stock

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3,620

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 571 parts In-Stock

1+ parts

$7.500

100+ parts

-

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571

$7.500

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Parana Technologies

USA . 1,574 parts In-Stock

1+ parts

$11.660

100+ parts

-

1k+ parts

$12.053

10k+ parts

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1,574

$11.660

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$12.053

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IDEA Electronic Components Group

UK . 1,305 parts In-Stock

1+ parts

$13.101

100+ parts

$12.446

1k+ parts

$11.791

10k+ parts

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1,305

$13.101

$12.446

$11.791

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ChromeModa Solutions

Germany . 407 parts In-Stock

1+ parts

$13.101

100+ parts

$10.743

1k+ parts

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407

$13.101

$10.743

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AZTECH Wire

Italy . 873 parts In-Stock

1+ parts

$15.374

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873

$15.374

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Perfect Parts

USA . 30,240 parts In-Stock

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30,240

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Corphita

USA . 3,186 parts In-Stock

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3,186

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Microchip USA

USA . 1,750 parts In-Stock

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1,750

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DigiPath Technology Company

USA . 264 parts In-Stock

1+ parts

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$11.812

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264

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$11.812

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Overview

Maximize your connectivity with the Texas Instruments MAX208CDBRG4 Line Drivers & Receivers, designed to deliver top-quality performance and reliability. This versatile component is perfect for a wide range of applications, offering seamless integration and superior functionality. With Texas Instruments leading the way in innovative technology, you can trust that this product will exceed your expectations. Elevate your projects with the MAX208CDBRG4 and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the components inside, making this product suitable for various environmental conditions.

Surface Mount: YES

Being surface mountable allows for easy installation on a PCB, saving space and making the product suitable for compact designs.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this product can handle a wide range of input voltages, providing flexibility in various applications.

No. of Functions: 4

Having 4 functions integrated into a single device simplifies circuit design, reduces component count, and saves board space.

Maximum Transmit Delay: 10000 ns

The maximum transmit delay of 10000 ns ensures fast and reliable signal transmission, essential for real-time communication applications.

Maximum Supply Current: 20 mA

With a low maximum supply current requirement, this product is energy-efficient and suitable for battery-powered devices.

Technical Specifications

Line Drivers & Receivers MAX208CDBRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

4

Maximum High Level Input Current:

.0002 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

10000 ns

Receiver No. of Bits:

4

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

10000 ns

Width:

5.3 mm

Trade Compliance

MAX208CDBRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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