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M38510/31401BEA

Texas Instruments

M38510/31401BEA by Texas Instruments

M38510/31401BEA by Texas Instruments is a MILITARY-grade Prescaler & Multivibrator with 2 functions, TTL technology, and 5V supply voltage. It has a propagation delay of 92ns and operates in temperatures ranging from -55 to 125°C. Ideal for applications requiring precise timing control in harsh environments.

Median Price

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Lifecycle Status

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In-Stock Inventory

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Digiode

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Vyrian

USA . 3,058 parts In-Stock

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Component Sense

UK . 426 parts In-Stock

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Electronic Expediters

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PAR Electronics

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Manoshevitz Elec. Sales

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QIE Inc.

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Beltway Electronics Company

USA . 8 parts In-Stock

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North Shore Components

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Electro Mavin

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NAC Semi

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One Stop Electronics

USA . 1,065 parts In-Stock

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$8.000

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AZTECH Wire

Italy . 296 parts In-Stock

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Parana Technologies

USA . 1,792 parts In-Stock

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DigiPath Technology Company

USA . 1,985 parts In-Stock

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ChromeModa Solutions

Germany . 564 parts In-Stock

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IDEA Electronic Components Group

UK . 141 parts In-Stock

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Microchip USA

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Overview

Discover the superior quality and reliability of the M38510/31401BEA by Texas Instruments, a leading manufacturer in the industry. This Prescaler & Multivibrators device offers exceptional performance and precision, making it ideal for a wide range of applications. With its advanced technology and military-grade components, this product delivers unparalleled value and benefits to customers. Trust Texas Instruments for top-of-the-line solutions that exceed expectations and drive success in your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Functions: 2

Having multiple functions in one device enhances its versatility and functionality.

Nominal Supply Voltage / Vsup (V): 5

Runs on a standard 5V supply voltage, making it compatible with a wide range of systems.

Propagation Delay (tpd): 92 ns

Low propagation delay ensures quick response times for signal processing.

Temperature Grade: MILITARY

Designed to withstand harsh operating conditions, making it suitable for military applications.

Technical Specifications

Prescaler & Multivibrators M38510/31401BEA attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

2

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay (tpd):

92 ns

Qualification:

Qualified

Screening Level:

MIL-PRF-38535 Class B

Maximum Seated Height:

5.08 mm

Sub-Category:

Prescaler/Multivibrator

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.92 mm

Trade Compliance

M38510/31401BEA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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