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LT1036MKJ

Texas Instruments

LT1036MKJ by Texas Instruments

LT1036MKJ by Texas Instruments is a bipolar series regulator with 4% voltage tolerance and 3A output current. It operates b/w -55°C to 150°C, making it suitable for industrial applications requiring precise voltage regulation in harsh environments. The cylindrical package with wire terminals ensures easy installation and robust performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,622 parts In-Stock

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Digiode

USA . 847 parts In-Stock

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847

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Parana Technologies

USA . 1,814 parts In-Stock

1+ parts

$5.517

100+ parts

-

1k+ parts

$6.267

10k+ parts

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1,814

$5.517

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$6.267

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DigiPath Technology Company

USA . 558 parts In-Stock

1+ parts

$6.075

100+ parts

$5.589

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-

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558

$6.075

$5.589

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ChromeModa Solutions

Germany . 6,527 parts In-Stock

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$6.199

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$5.083

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6,527

$6.199

$5.083

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IDEA Electronic Components Group

UK . 2,040 parts In-Stock

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$6.199

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$5.579

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2,040

$6.199

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$5.579

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Semicontronic

India . 815 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

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$7.275

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815

$7.500

$7.312

$7.275

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Ampacity Inc.

Singapore . 634 parts In-Stock

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$7.500

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634

$7.500

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AZTECH Wire

Italy . 363 parts In-Stock

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$8.533

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$8.533

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One Stop Electronics

USA . 503 parts In-Stock

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$12.500

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Corphita

USA . 3,360 parts In-Stock

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Corohmni

South Africa . 130 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the LT1036MKJ, a top-of-the-line regulator designed for various applications. With its metal package body material and bipolar technology, this regulator offers unmatched performance and durability. Whether you need precise voltage regulation or consistent power output, the LT1036MKJ delivers with a maximum load regulation of 0.08% and a maximum output current of 3A. Trust in Texas Instruments to provide cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body material provides durability and heat dissipation, making the regulator suitable for high temperature environments.

Technology: BIPOLAR

Bipolar technology ensures stable and precise regulation of voltage, making the regulator reliable for various applications.

Package Shape: ROUND

Round package shape allows for compact and efficient design, saving space in electronic circuits.

Maximum Voltage Tolerance: 4 %

Low maximum voltage tolerance ensures accurate and consistent voltage regulation, improving overall performance of connected devices.

No. of Terminals: 4

Having 4 terminals provides flexibility in connection options, allowing versatile use in different circuit configurations.

Maximum Operating Temperature: 150 °C

High maximum operating temperature range ensures the regulator can withstand elevated temperatures without compromising performance.

Maximum Output Current: 3 A

Capable of providing a maximum output current of 3 A, making it suitable for powering a range of electronic components.

Technical Specifications

Other Function Regulators LT1036MKJ attributes and parameters. Explore more Other Function Regulators devices from Texas Instruments

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

3.48 V

Maximum Input Voltage Absolute:

JESD-30 Code:

O-MBCY-W4

Maximum Line Regulation:

.06 %

Maximum Load Regulation:

.08 %

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current-1:

3 A

Package Body Material:

METAL

Package Equivalence Code:

CAN4/5,.45FL

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Qualification Status:

Not Qualified

Regulator Type:

Sub-Category:

Other Regulators

Technology:

BIPOLAR

Terminal Form:

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

4 %

Trade Compliance

LT1036MKJ Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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