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LT1013TDJ2

Texas Instruments

LT1013TDJ2 by Texas Instruments

LT1013TDJ2 by Texas Instruments is a dual operational amplifier (Op Amp) with 19 terminals in a rectangular package. It is surface mountable, measuring 2.03mm in width and 2.234mm in length. Ideal for applications requiring two amplification functions in a compact design, such as signal processing circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,182 parts In-Stock

1+ parts

-

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5,182

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Digiode

USA . 4,032 parts In-Stock

1+ parts

-

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-

1k+ parts

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4,032

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 843 parts In-Stock

1+ parts

$3.410

100+ parts

-

1k+ parts

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-

843

$3.410

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-

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Parana Technologies

USA . 979 parts In-Stock

1+ parts

$3.507

100+ parts

-

1k+ parts

$4.032

10k+ parts

-

979

$3.507

-

$4.032

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DigiPath Technology Company

USA . 2,351 parts In-Stock

1+ parts

$3.862

100+ parts

-

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-

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2,351

$3.862

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ChromeModa Solutions

Germany . 5,693 parts In-Stock

1+ parts

$3.941

100+ parts

$3.232

1k+ parts

-

10k+ parts

-

5,693

$3.941

$3.232

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IDEA Electronic Components Group

UK . 1,177 parts In-Stock

1+ parts

$3.941

100+ parts

-

1k+ parts

$3.547

10k+ parts

-

1,177

$3.941

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$3.547

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AZTECH Wire

Italy . 365 parts In-Stock

1+ parts

$10.623

100+ parts

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365

$10.623

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Microchip USA

USA . 1,998 parts In-Stock

1+ parts

$209.710

100+ parts

$204.110

1k+ parts

$207.240

10k+ parts

$204.360

1,998

$209.710

$204.110

$207.240

$204.360

Corphita

USA . 1,851 parts In-Stock

1+ parts

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1,851

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Overview

Unleash the power of precision with the LT1013TDJ2 by Texas Instruments. This high-quality operational amplifier offers unmatched performance and reliability, making it the perfect choice for a wide range of applications. With its compact size and surface mount design, this dual-function op amp is ideal for space-constrained projects. Trust Texas Instruments to deliver exceptional value and innovation with the LT1013TDJ2, providing customers with the competitive edge they need to succeed in today's fast-paced market.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and reducing overall product size.

No. of Functions: 2

Having multiple functions in a single package can simplify circuit design and reduce the number of components required.

Package Shape: RECTANGULAR

Rectangular package shape is standard and commonly used, making it easy to integrate into existing designs.

No. of Terminals: 19

Having a higher number of terminals allows for more versatile connections and functionality in the circuit.

Package Style (Meter): UNCASED CHIP

Uncased chip package style provides a compact and lightweight design, ideal for applications where space and weight are critical.

Terminal Position: UPPER

Upper terminal position makes it easier to solder and connect the chip in the PCB assembly process.

Width: 2.03 mm

Narrow width enables close placement of multiple components on the PCB, optimizing layout and reducing interference.

Length: 2.234 mm

Compact length allows for space-efficient placement on the PCB, enabling dense circuit designs.

Terminal Form: NO LEAD

No lead terminals reduce the risk of short circuits and simplify the soldering process during assembly.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile and widely used in many electronic circuits for signal processing and amplification.

Packing Method: TUBE

Tube packaging provides protection during transportation and storage, ensuring the components remain in good condition before assembly.

Technical Specifications

Operational Amplifiers (Op Amps) LT1013TDJ2 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

2

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.088 in (2.234 mm)

Width:

0.08 in (2.03 mm)

Total Terminals:

19

Terminal Position:

Upper

Terminal Form:

Surface Mount:

Yes

Standards

JESD-30 Code:

R-XUUC-N19

Packaging and Shipping

Packing Method:

Tube

Package Code:

DIE

Package Shape:

Package Style:

Uncased Chip

Trade Compliance

LT1013TDJ2 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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