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LSF0204DRGYR

Texas Instruments

LSF0204DRGYR by Texas Instruments

LSF0204DRGYR by Texas Instruments is a 4-bit interface IC with a square package and surface mount capability. It operates at temperatures ranging from -40 to 125 °C and has a max supply current of 0.0125 mA. This IC is commonly used in automotive applications due to its temperature grade and moisture sensitivity level.

Median Price

$0.679

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 27,294 parts In-Stock

1+ parts

$0.679

100+ parts

$0.523

1k+ parts

$0.275

10k+ parts

-

27,294

$0.679

$0.523

$0.275

-

Mouser Electronics

USA . 4,484 parts In-Stock

1+ parts

$1.160

100+ parts

$0.671

1k+ parts

$0.583

10k+ parts

$0.533

4,484

$1.160

$0.671

$0.583

$0.533

Rochester

USA . 43,182 parts In-Stock

1+ parts

-

100+ parts

$0.647

1k+ parts

$0.537

10k+ parts

$0.479

43,182

-

$0.647

$0.537

$0.479

DigiKey

USA . 43,182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.810

10k+ parts

-

43,182

-

-

$0.810

-

Verical

USA . 43,182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.671

10k+ parts

$0.598

43,182

-

-

$0.671

$0.598

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,440 parts In-Stock

1+ parts

$0.363

100+ parts

-

1k+ parts

-

10k+ parts

-

4,440

$0.363

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.378

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$0.378

-

-

-

DigiKey Marketplace

USA . 43,182 parts In-Stock

1+ parts

-

100+ parts

$0.400

1k+ parts

-

10k+ parts

-

43,182

-

$0.400

-

-

Vyrian

USA . 18,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,424

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 18,479 parts In-Stock

1+ parts

$0.325

100+ parts

-

1k+ parts

-

10k+ parts

-

18,479

$0.325

-

-

-

Corphita

USA . 4,290 parts In-Stock

1+ parts

$0.344

100+ parts

-

1k+ parts

-

10k+ parts

-

4,290

$0.344

-

-

-

Continental Prestige Electronics

USA . 6,536 parts In-Stock

1+ parts

$0.378

100+ parts

-

1k+ parts

-

10k+ parts

$0.371

6,536

$0.378

-

-

$0.371

Argo Parts USA

USA . 994 parts In-Stock

1+ parts

$0.378

100+ parts

-

1k+ parts

-

10k+ parts

$0.367

994

$0.378

-

-

$0.367

Parana Technologies

USA . 614 parts In-Stock

1+ parts

$4.253

100+ parts

-

1k+ parts

$4.686

10k+ parts

-

614

$4.253

-

$4.686

-

DigiPath Technology Company

USA . 95 parts In-Stock

1+ parts

$4.683

100+ parts

-

1k+ parts

-

10k+ parts

-

95

$4.683

-

-

-

IDEA Electronic Components Group

UK . 1,677 parts In-Stock

1+ parts

$4.779

100+ parts

-

1k+ parts

$4.301

10k+ parts

-

1,677

$4.779

-

$4.301

-

ChromeModa Solutions

Germany . 435 parts In-Stock

1+ parts

$4.779

100+ parts

$3.919

1k+ parts

-

10k+ parts

-

435

$4.779

$3.919

-

-

A-Z Elektronik GmbH

Germany . 11,140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,140

-

-

-

-

Kepictronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,000

-

-

-

-

Alle Elektronik GmbH

Germany . 4,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,760

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$0.371

1k+ parts

$0.359

10k+ parts

$0.352

50

-

$0.371

$0.359

$0.352

Overview

Discover the cutting-edge LSF0204DRGYR by Texas Instruments, a high-quality Other Function Interface IC that revolutionizes connectivity. With its compact and durable design, this square-shaped chip carrier offers numerous advantages for various applications. Experience seamless integration with its 3-STATE output characteristics and a wide range of power supplies. Designed to meet automotive standards, this product ensures reliability even in extreme temperatures. Unlock the full potential of your projects with the LSF0204DRGYR and enjoy the benefits of superior performance and lasting value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to external elements, making it suitable for various applications in different environments.

Surface Mount: YES

The surface mount feature allows for easy installation and enables compact designs, ideal for space-constrained applications.

Package Shape: SQUARE

The square shape facilitates efficient PCB layout and component placement, contributing to optimized circuit designs.

No. of Bits: 4

With a 4-bit design, this product offers sufficient processing power and data manipulation capabilities for many digital applications.

Power Supplies (V): 1/4.5,1.8/5.5

The wide range of compatible input voltages makes this product versatile and adaptable to different power sources and voltage levels.

No. of Terminals: 14

The 14 terminals provide sufficient connectivity options, accommodating various interfacing requirements and allowing for versatile integration.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier and heat sink/slug package styles, along with a very thin profile, enhance thermal management and improve heat dissipation, ensuring the product's reliability even in demanding conditions.

Maximum Operating Temperature: 125 °C

This high maximum operating temperature ensures the product's reliability and functionality, even in environments where temperature fluctuations or high heat levels are common.

Output Characteristics: 3-STATE

The 3-state output allows for flexible control and efficient utilization of the product within a broader system, optimizing overall performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the product to operate effectively in harsh and extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel, palladium, and gold terminal finish guarantees excellent conductivity, corrosion resistance, and durability, ensuring reliable electrical connections and prolonged product lifespan.

Terminal Position: QUAD

The Quad terminal position allows for convenient and standardized installation on PCBs, streamlining assembly processes and improving overall manufacturing efficiency.

Maximum Seated Height: 1 mm

The low-seated height facilitates compact designs, enabling the product to fit into space-limited applications without sacrificing performance or functionality.

Width: 3.5 mm

The compact width of 3.5 mm ensures efficient utilization of space and promotes miniaturization of circuitry, making this product suitable for compact and portable devices.

Maximum Time At Peak Reflow Temperature (s): 30

The extended time at peak reflow temperature provides sufficient thermal exposure to ensure reliable solder connections during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures efficient soldering and assembly processes, facilitating reliable and robust product integration.

Length: 3.5 mm

The short length of 3.5 mm contributes to compact PCB designs, enabling the product to be incorporated into space-constrained electronic systems easily.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures the product's reliability and robustness within the challenging environmental conditions typically found in automotive applications.

Terminal Form: NO LEAD

The absence of lead terminals promotes eco-friendly designs and aligns with global regulations and initiatives aimed at reducing hazardous materials.

Maximum Supply Current: 0.0125 mA

The low maximum supply current requirement enhances energy efficiency and makes this product suitable for low-power applications with limited power budgets.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density packaging, enabling more components to be integrated into limited PCB space, expanding functionality and versatility.

Moisture Sensitivity Level (MSL): 2

The moderate moisture sensitivity level ensures proper handling and storage requirements, preventing moisture-related defects during the manufacturing and assembly processes.

Interface IC Type: INTERFACE CIRCUIT

This product's interface IC type enables seamless communication and connectivity between various components, serving as a vital link in a system, and facilitating efficient data exchange.

Technical Specifications

Other Function Interface ICs LSF0204DRGYR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N14

JESD-609 Code:

e4

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Bits:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14/18,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/4.5,1.8/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.0125 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

LSF0204DRGYR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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