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LP3965EMPX-ADJ

Texas Instruments

LP3965EMPX-ADJ by Texas Instruments

LP3965EMPX-ADJ by Texas Instruments is an adjustable positive single output LDO regulator with a max output current of 1.5A and a dropout voltage of 0.55V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.

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7

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1k+

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Vyrian

USA . 8,705 parts In-Stock

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Chip Stock

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R&J Components

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Anansix

USA . 856 parts In-Stock

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Digiode

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ComSIT Distribution GmbH

Germany . 348 parts In-Stock

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MRC Electronics

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Parana Technologies

USA . 1,185 parts In-Stock

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$7.591

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$8.102

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AZTECH Wire

Italy . 877 parts In-Stock

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DigiPath Technology Company

USA . 663 parts In-Stock

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$8.358

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$7.690

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ChromeModa Solutions

Germany . 5,517 parts In-Stock

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$8.529

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$6.994

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IDEA Electronic Components Group

UK . 344 parts In-Stock

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One Stop Electronics

USA . 362 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

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Corphita

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Alle Elektronik GmbH

Germany . 3,199 parts In-Stock

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Perfect Parts

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Microchip USA

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Overview

Power up your projects with the LP3965EMPX-ADJ by Texas Instruments, a top-of-the-line adjustable regulator that guarantees superior quality and reliability. This cutting-edge product is perfect for a wide range of applications, offering customers unparalleled value, efficiency, and performance. Say goodbye to downtime and hello to seamless operation with this must-have component from a trusted manufacturer. Upgrade your designs today with the LP3965EMPX-ADJ and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability, making the product suitable for various applications.

Maximum Dropout Voltage: 1.55 V

Low dropout voltage ensures efficient power regulation, making it ideal for applications where energy efficiency is crucial.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving, making it convenient for compact electronic devices.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range ensures stable performance even in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making the product suitable for battery-powered devices.

Adjustability: ADJUSTABLE

Adjustable output voltage allows for flexibility in various applications, providing customized solutions.

Maximum Output Current: 1.5 A

High output current capability makes it suitable for powering a wide range of electronic components.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO LP3965EMPX-ADJ attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.55 V

Nominal Dropout Voltage-1:

.24 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

1.5 A

Maximum Output Voltage-1:

5.1 V

Minimum Output Voltage-1:

1.216 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223-4

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.8 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.5 mm

Terminal Position:

DUAL

Width:

3.56 mm

Trade Compliance

LP3965EMPX-ADJ Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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