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LP2996MR

Texas Instruments

LP2996MR by Texas Instruments

LP2996MR by Texas Instruments is a DDR termination regulator with 1.5A max output current and 0.9V min output voltage. It comes in a small outline package suitable for surface mount applications, making it ideal for compact electronic devices requiring precise power regulation.

Median Price

$1.663

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

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Rochester

USA . 18,144 parts In-Stock

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-

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$1.600

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$1.330

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$1.180

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Verical

USA . 18,107 parts In-Stock

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$1.663

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$1.475

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$1.475

DigiKey

USA . 2,247 parts In-Stock

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Digiode

USA . 2,112 parts In-Stock

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Vyrian

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DigiKey Marketplace

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PAR Electronics

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DF Sales Co.

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LIBRA Elektronik GmbH

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Microfarads

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Atlantic Semiconductor

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Semtec, LLC

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Martec Srl

Italy . 126 parts In-Stock

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EPE Components Inc.

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Inventory MP

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PC Components Company LLC

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Elcom Components

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SPM Sales

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Semi Source

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Speed Components Ltd

Israel . 41 parts In-Stock

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North Shore Components

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Manoshevitz Elec. Sales

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Sunrise Surplus Inc.

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LWI Electronics Inc

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Corphita

USA . 3,222 parts In-Stock

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$1.179

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Component Stockers USA

USA . 2,120 parts In-Stock

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$1.350

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$1.270

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$1.150

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$1.150

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$1.150

Parana Technologies

USA . 1,161 parts In-Stock

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$8.342

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$8.969

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DigiPath Technology Company

USA . 914 parts In-Stock

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$9.186

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$8.451

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ChromeModa Solutions

Germany . 6,525 parts In-Stock

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IDEA Electronic Components Group

UK . 746 parts In-Stock

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$8.904

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$8.436

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QUARKTWIN TECHNOLOGY LTD

USA . 23,267 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,800 parts In-Stock

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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Alle Elektronik GmbH

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Perfect Parts

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GreenTree Electronics

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Authorized Procurement Solutions

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Fairview Electronics Ltd

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Overview

Elevate your electronic designs with the LP2996MR by Texas Instruments. Crafted with precision and quality, this regulator offers unparalleled performance for a wide range of applications. From powering DDR terminations to ensuring stable voltage outputs, this product is a must-have for any project requiring reliable power management. Trust in Texas Instruments' reputation for excellence and innovation, and experience the benefits of seamless operation and enhanced efficiency with the LP2996MR. Upgrade your designs today and unlock the potential of your electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount capability makes installation easy and efficient, saving time and effort in the assembly process.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space, maximizing component density and design flexibility.

Terminal Form: GULL WING

The gull wing terminal form provides reliable solder connections and easy inspection during manufacturing, ensuring quality and consistency.

Packing Method: TUBE

The tube packing method protects the product from damage during shipping and storage, ensuring product integrity and reliability.

Minimum Output Voltage: -1.9 V

The minimum output voltage of -1.9V allows for precise control and regulation of power supply, suitable for a wide range of applications.

No. of Terminals: 8

The 8 terminals provide versatile connectivity options and compatibility with various PCB layouts, offering flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

The small outline, heat sink/slug, and low profile package style enables efficient heat dissipation and space-saving design, suitable for compact and high-performance applications.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise placement on the PCB, ensuring proper alignment and connections for optimal performance.

Regulator Type: DDR TERMINATION REGULATOR

The DDR termination regulator type is specifically designed for DDR memory modules, providing stable and reliable power supply for memory operations.

Terminal Position: DUAL

The dual terminal position enhances electrical connectivity and stability, reducing resistance and improving overall performance.

Maximum Seated Height: 1.7 mm

The maximum seated height of 1.7mm allows for low-profile and space-efficient installation, ideal for compact and slim devices.

Width: 3.9 mm

The width of 3.9mm offers space-saving benefits and compatibility with various PCB layouts, enabling versatile integration in different applications.

Maximum Output Current: 1.5 A

The maximum output current of 1.5A provides sufficient power for demanding applications, ensuring stable and reliable performance under heavy loads.

Length: 4.9 mm

The length of 4.9mm contributes to a compact and efficient design, suitable for space-constrained applications without compromising functionality.

Maximum Input Voltage: 5.5 V

The maximum input voltage of 5.5V allows for compatibility with a wide range of power sources, ensuring adaptability and versatility in different operating conditions.

Technical Specifications

Other Function Regulators LP2996MR attributes and parameters. Explore more Other Function Regulators devices from Texas Instruments

Specs

Maximum Input Voltage:

5.5 V

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Maximum Output Current-1:

1.5 A

Minimum Output Voltage-1:

.9 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

Packing Method:

TUBE

Regulator Type:

Maximum Seated Height:

1.7 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

LP2996MR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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