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LP2995LQX

Texas Instruments

LP2995LQX by Texas Instruments

LP2995LQX by Texas Instruments is a DDR termination regulator with 16 terminals in a square chip carrier package. It features a terminal pitch of 0.5mm and max seated height of 0.8mm, suitable for surface mount applications. This plastic/epoxy regulator is ideal for compact designs requiring precise voltage regulation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,402 parts In-Stock

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6,402

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Digiode

USA . 4,731 parts In-Stock

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Anansix

USA . 2,061 parts In-Stock

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2,061

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Distributors (Availability)

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Parana Technologies

USA . 2,282 parts In-Stock

1+ parts

$9.959

100+ parts

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$10.524

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2,282

$9.959

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$10.524

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DigiPath Technology Company

USA . 1,394 parts In-Stock

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$10.966

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$10.089

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1,394

$10.966

$10.089

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ChromeModa Solutions

Germany . 3,509 parts In-Stock

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$11.190

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$9.176

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3,509

$11.190

$9.176

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IDEA Electronic Components Group

UK . 1,986 parts In-Stock

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$11.190

100+ parts

$10.630

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$10.071

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1,986

$11.190

$10.630

$10.071

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One Stop Electronics

USA . 1,076 parts In-Stock

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$11.500

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1,076

$11.500

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AZTECH Wire

Italy . 398 parts In-Stock

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$19.877

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398

$19.877

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Kepictronics

USA . 7,589 parts In-Stock

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Corphita

USA . 2,911 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,517 parts In-Stock

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1,517

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Perfect Parts

USA . 168 parts In-Stock

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168

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Overview

Experience the superior quality and reliability of Texas Instruments with the LP2995LQX Other Function Regulator. This cutting-edge product offers unparalleled performance and efficiency in a compact, easy-to-install package. Perfect for a wide range of applications, from industrial to automotive, this regulator ensures stable power supply with minimal heat dissipation. Trust Texas Instruments to deliver top-notch solutions for your power management needs. Elevate your projects with the LP2995LQX and enjoy seamless operation and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the regulator easy to handle and long-lasting.

Surface Mount: YES

Allows for easy installation on circuit boards without the need for additional mounting hardware.

Package Shape: SQUARE

Square shape ensures a compact design, saving valuable space on the circuit board.

Terminal Form: NO LEAD

Lead-free terminals are environmentally friendly and comply with RoHS directives.

Packing Method: TR

TR packing method is ideal for automated assembly processes, increasing productivity.

No. of Terminals: 16

Having 16 terminals allows for a greater range of connectivity options, making the regulator versatile.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles provide flexibility in design and help optimize thermal management for improved performance.

Terminal Pitch: 0.5 mm

Fine pitch terminal spacing allows for high-density mounting, enabling more components to be placed on the board.

Regulator Type: DDR TERMINATION REGULATOR

DDR termination regulator ensures stable voltage supply for DDR memory modules, enhancing system reliability.

Terminal Position: QUAD

Quad terminal position simplifies connection to other components, reducing wiring complexity.

Maximum Seated Height: 0.8 mm

Low seated height minimizes overall profile, making it suitable for slim devices and applications with space constraints.

Width: 4 mm

Compact width facilitates placement in tight spaces, allowing for efficient use of board real estate.

Length: 4 mm

Short length ensures a small footprint on the board, enabling the regulator to be integrated into compact designs.

Technical Specifications

Other Function Regulators LP2995LQX attributes and parameters. Explore more Other Function Regulators devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N16

Length:

4 mm

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,20

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Regulator Type:

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

LP2995LQX Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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