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LP2967IMMX-2833

Texas Instruments

LP2967IMMX-2833 by Texas Instruments

Texas Instruments LP2967IMMX-2833 is a dual-output LDO regulator with 3.3V and 2.8V outputs, suitable for applications requiring stable voltage supply. It offers a max dropout voltage of 0.425V, operates in temperatures from -40°C to 125°C, and has a compact package style ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,204 parts In-Stock

1+ parts

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3,204

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Vyrian

USA . 2,967 parts In-Stock

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2,967

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Anansix

USA . 879 parts In-Stock

1+ parts

-

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879

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 203 parts In-Stock

1+ parts

$4.263

100+ parts

-

1k+ parts

$4.695

10k+ parts

-

203

$4.263

-

$4.695

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DigiPath Technology Company

USA . 818 parts In-Stock

1+ parts

$4.694

100+ parts

$4.319

1k+ parts

-

10k+ parts

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818

$4.694

$4.319

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IDEA Electronic Components Group

UK . 482 parts In-Stock

1+ parts

$4.790

100+ parts

-

1k+ parts

$4.311

10k+ parts

-

482

$4.790

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$4.311

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ChromeModa Solutions

Germany . 214 parts In-Stock

1+ parts

$4.790

100+ parts

$3.928

1k+ parts

-

10k+ parts

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214

$4.790

$3.928

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AZTECH Wire

Italy . 371 parts In-Stock

1+ parts

$18.657

100+ parts

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371

$18.657

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One Stop Electronics

USA . 838 parts In-Stock

1+ parts

$23.500

100+ parts

-

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838

$23.500

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Corphita

USA . 4,645 parts In-Stock

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4,645

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Alle Elektronik GmbH

Germany . 3,482 parts In-Stock

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3,482

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Overview

Unlock the power of reliable and efficient voltage regulation with the LP2967IMMX-2833 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality products that cater to various applications. This fixed positive multiple output LDO regulator offers seamless performance and precision, ensuring stable voltage outputs for your devices. With its compact design and advanced features, the LP2967IMMX-2833 provides unparalleled value and benefits to customers seeking optimal power management solutions. Trust Texas Instruments to meet your voltage regulation needs with excellence and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the regulator.

Maximum Dropout Voltage-2: 2.425 V

Low dropout voltage ensures efficient power conversion and minimal power loss.

Surface Mount: YES

Allows for easy and convenient installation on a circuit board.

Operating Temperature (TJ-Max): 125 °C

Can operate effectively in high-temperature environments without risk of damage.

Nominal Output Voltage-2: 3.3 V

Provides a stable and consistent output voltage for connected devices.

Terminal Form: GULL WING

Facilitates secure and reliable connections to other components.

No. of Terminals: 8

Offers multiple connection points for versatile application possibilities.

Regulator Type: FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

Suitable for applications requiring multiple regulated output voltages with low dropout voltage.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LP2967IMMX-2833 attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.425 V

Maximum Dropout Voltage-2:

.425 V

Maximum Input Voltage:

16 V

Minimum Input Voltage:

3.8 V

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

2.884 V

Minimum Output Voltage-1:

2.716 V

Nominal Output Voltage-1:

2.8 V

Maximum Output Voltage-2:

3.399 V

Minimum Output Voltage-2:

3.201 V

Nominal Output Voltage-2:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.09 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Width:

3 mm

Trade Compliance

LP2967IMMX-2833 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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