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LP2967IBPX-2833

Texas Instruments

LP2967IBPX-2833 by Texas Instruments

LP2967IBPX-2833 by Texas Instruments is a fixed positive multiple output LDO regulator with 2 outputs. It has a max dropout voltage of 0.425 V and operates in temperatures ranging from -40 to 125°C. Ideal for applications requiring precise voltage regulation in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,567 parts In-Stock

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Anansix

USA . 2,502 parts In-Stock

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Digiode

USA . 948 parts In-Stock

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948

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One Stop Electronics

USA . 309 parts In-Stock

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$8.500

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309

$8.500

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Parana Technologies

USA . 342 parts In-Stock

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$8.594

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$9.256

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342

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$9.256

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DigiPath Technology Company

USA . 1,730 parts In-Stock

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$9.463

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$9.463

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ChromeModa Solutions

Germany . 1,927 parts In-Stock

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$9.656

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$7.918

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1,927

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$7.918

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IDEA Electronic Components Group

UK . 1,489 parts In-Stock

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$9.656

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$9.173

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$8.690

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1,489

$9.656

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$8.690

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AZTECH Wire

Italy . 705 parts In-Stock

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$13.275

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$13.275

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Corphita

USA . 2,476 parts In-Stock

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Overview

Enhance your electronic designs with the LP2967IBPX-2833 by Texas Instruments, a top-tier manufacturer known for its quality products. This fixed positive multiple output LDO regulator offers precise voltage regulation, ensuring stable power supply for your devices. With a compact design and high efficiency, this regulator is perfect for applications in various industries, from consumer electronics to industrial automation. Trust Texas Instruments to deliver reliable solutions that bring value and performance to your projects. Upgrade your designs today with the LP2967IBPX-2833.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and reliability for the regulator.

Maximum Dropout Voltage-2: 2.425 V

Low maximum dropout voltage ensures efficient power conversion and minimal power loss.

Surface Mount: YES

Surface mount capability makes it easy to integrate the regulator onto circuit boards for streamlined assembly.

Operating Temperature (TJ-Max): 125 °C

The high maximum operating temperature allows for reliable performance in various environmental conditions.

Minimum Output Voltage-2: 3.201 V

Stable minimum output voltage ensures consistent power delivery to connected components.

Nominal Output Voltage-2: 3.3 V

The nominal output voltage of 3.3V provides a standard power supply level for compatible devices.

No. of Terminals: 8

Having 8 terminals allows for multiple connection points, enabling flexible installation and configuration options.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The unique package style of grid array with a thin profile and fine pitch enhances space efficiency and ease of PCB layout.

Regulator Type: FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

Being a fixed positive multiple output LDO regulator, it offers stable and regulated power output for multiple components in a circuit.

Maximum Input Voltage: 16 V

High maximum input voltage tolerance makes it suitable for a wide range of power supply scenarios.

Maximum Output Current-1: 0.15 A

The maximum output current of 0.15A ensures sufficient power delivery capability for connected devices.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LP2967IBPX-2833 attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.425 V

Maximum Dropout Voltage-2:

.425 V

Maximum Input Voltage:

16 V

Minimum Input Voltage:

3.8 V

JESD-30 Code:

R-PBGA-B8

Length:

1.946 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

2.884 V

Minimum Output Voltage-1:

2.716 V

Nominal Output Voltage-1:

2.8 V

Maximum Output Voltage-2:

3.399 V

Minimum Output Voltage-2:

3.201 V

Nominal Output Voltage-2:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.85 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

3 %

Width:

1.412 mm

Trade Compliance

LP2967IBPX-2833 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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