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LP2967IBP-2626

Texas Instruments

LP2967IBP-2626 by Texas Instruments

LP2967IBP-2626 by Texas Instruments is a fixed positive multiple output LDO regulator with 2.6V nominal output voltage. It has a max dropout voltage of 0.425V, operates in temperatures ranging from -40 to 125°C, and supports surface mount installation. Ideal for applications requiring precise voltage regulation in compact electronic devices.

Median Price

$0.916

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 250 parts In-Stock

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Digiode

USA . 1,120 parts In-Stock

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$0.916

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$0.916

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Vyrian

USA . 7,017 parts In-Stock

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7,017

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R&J Components

USA . 500 parts In-Stock

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Anansix

USA . 415 parts In-Stock

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415

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Distributors (Availability)

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Corphita

USA . 4,129 parts In-Stock

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$0.868

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$0.868

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Vigor

Singapore . 250 parts In-Stock

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$0.930

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$0.930

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Component Stockers USA

USA . 181 parts In-Stock

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$0.990

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$0.930

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181

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$0.930

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Parana Technologies

USA . 1,072 parts In-Stock

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$8.661

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$9.336

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1,072

$8.661

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$9.336

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DigiPath Technology Company

USA . 781 parts In-Stock

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$9.536

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$8.773

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781

$9.536

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ChromeModa Solutions

Germany . 4,986 parts In-Stock

1+ parts

$9.731

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$7.979

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4,986

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IDEA Electronic Components Group

UK . 714 parts In-Stock

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$9.731

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$9.244

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$8.758

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714

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$8.758

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QUARKTWIN TECHNOLOGY LTD

USA . 7,907 parts In-Stock

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Microchip USA

USA . 491 parts In-Stock

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Overview

Enhance your electronic designs with the LP2967IBP-2626 by Texas Instruments. Crafted with top-notch quality and precision, this fixed positive multiple output LDO regulator offers unbeatable performance and reliability. Ideal for various applications, this product ensures stable power supply with minimal dropout voltage. With its compact design and efficient output, customers can enjoy seamless operation and enhanced functionality in their projects. Trust Texas Instruments to deliver superior solutions that exceed expectations every time. Elevate your designs with the LP2967IBP-2626 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material for long-lasting performance.

Maximum Dropout Voltage-1: 2.425 V

Low dropout voltage ensures efficient power regulation.

Surface Mount: YES

Can be easily mounted on PCB for convenient installation.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range for versatility in various environments.

Nominal Output Voltage-2: 2.6 V

Stable output voltage for consistent performance.

Package Shape: RECTANGULAR

Compact design for space-saving in applications.

Operating Temperature (TJ-Min): -40 °C

Can operate at low temperature conditions.

No. of Terminals: 8

Sufficient terminals for easy connections.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Advanced packaging technology for high density designs.

Terminal Position: BOTTOM

Convenient terminal placement for connections.

Maximum Seated Height: 0.85 mm

Low profile design for compact installations.

Width: 1.412 mm

Slim width for fitting in tight spaces.

Minimum Input Voltage: 3.6 V

Wide input voltage range for compatibility.

Maximum Output Current-1: 0.15 A

High output current for powering multiple components.

No. of Outputs: 2

Multiple outputs for versatile power distribution.

Maximum Input Voltage: 16 V

Suitable for various input voltage levels.

Maximum Output Current-2: 0.15 A

Sufficient output current for multiple loads.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LP2967IBP-2626 attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.425 V

Maximum Dropout Voltage-2:

.425 V

Maximum Input Voltage:

16 V

Minimum Input Voltage:

3.6 V

JESD-30 Code:

R-PBGA-B8

Length:

1.946 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

2.678 V

Minimum Output Voltage-1:

2.522 V

Nominal Output Voltage-1:

2.6 V

Maximum Output Voltage-2:

2.678 V

Minimum Output Voltage-2:

2.522 V

Nominal Output Voltage-2:

2.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.85 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

1.412 mm

Trade Compliance

LP2967IBP-2626 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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