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LP2966IMMX-2525

Texas Instruments

LP2966IMMX-2525 by Texas Instruments

LP2966IMMX-2525 by Texas Instruments is a fixed positive multiple output LDO regulator with 2.5V nominal output voltage and 3% max voltage tolerance. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring stable power supplies in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,894 parts In-Stock

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8,894

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Anansix

USA . 1,845 parts In-Stock

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1,845

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Digiode

USA . 416 parts In-Stock

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416

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Distributors (Availability)

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Parana Technologies

USA . 1,385 parts In-Stock

1+ parts

$3.062

100+ parts

-

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$3.576

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1,385

$3.062

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$3.576

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IDEA Electronic Components Group

UK . 1,776 parts In-Stock

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$3.440

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$3.096

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1,776

$3.440

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$3.096

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ChromeModa Solutions

Germany . 612 parts In-Stock

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$3.440

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$2.821

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612

$3.440

$2.821

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AZTECH Wire

Italy . 659 parts In-Stock

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$6.095

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659

$6.095

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One Stop Electronics

USA . 449 parts In-Stock

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$17.500

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449

$17.500

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Corphita

USA . 2,987 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,572 parts In-Stock

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1,572

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DigiPath Technology Company

USA . 1,500 parts In-Stock

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$3.102

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1,500

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$3.102

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Microchip USA

USA . 397 parts In-Stock

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397

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Perfect Parts

USA . 119 parts In-Stock

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119

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Overview

Experience superior performance and reliability with the LP2966IMMX-2525 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality in their Fixed Regulators - Positive Multiple Output LDO category. This versatile product offers unmatched value and benefits, making it ideal for various applications. Trust Texas Instruments to provide you with cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the LP2966IMMX-2525 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides good durability and protection for the regulator, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and making it ideal for compact designs.

Operating Temperature (TJ-Max): 125 °C

High operating temperature range up to 125°C ensures reliable performance in a wide range of environmental conditions.

Minimum Output Voltage-1: 2.425 V

Provides a stable minimum output voltage of 2.425V, ensuring precise regulation for connected components.

Nominal Output Voltage-2: 2.5 V

Stable nominal output voltage of 2.5V ensures consistent power supply to connected devices.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, enabling compact and effective designs.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections, enhancing the overall performance and durability of the regulator.

Operating Temperature (TJ-Min): -40 °C

Low operating temperature down to -40°C ensures the regulator can operate in extreme cold conditions without compromising performance.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LP2966IMMX-2525 attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Maximum Input Voltage:

7 V

Minimum Input Voltage:

2.7 V

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

2.575 V

Minimum Output Voltage-1:

2.425 V

Nominal Output Voltage-1:

2.5 V

Maximum Output Voltage-2:

2.575 V

Minimum Output Voltage-2:

2.425 V

Nominal Output Voltage-2:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.09 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Width:

3 mm

Trade Compliance

LP2966IMMX-2525 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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