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LP2960AIMX-3.3

Texas Instruments

LP2960AIMX-3.3 by Texas Instruments

LP2960AIMX-3.3 by Texas Instruments is a BIPOLAR LDO Regulator with 16 terminals, offering a max output current of 0.5 A and dropout voltage of 0.8 V. Ideal for applications requiring an adjustable positive single output regulator in a compact package style with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,697 parts In-Stock

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Digiode

USA . 3,428 parts In-Stock

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Anansix

USA . 1,802 parts In-Stock

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AZTECH Wire

Italy . 571 parts In-Stock

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$6.655

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571

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Parana Technologies

USA . 992 parts In-Stock

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$7.424

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$7.914

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992

$7.424

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DigiPath Technology Company

USA . 2,024 parts In-Stock

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$8.175

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$7.521

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$8.175

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IDEA Electronic Components Group

UK . 1,140 parts In-Stock

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$8.342

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$7.925

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$7.508

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1,140

$8.342

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$7.508

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ChromeModa Solutions

Germany . 743 parts In-Stock

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$8.342

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$6.840

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743

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One Stop Electronics

USA . 357 parts In-Stock

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$20.500

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QUARKTWIN TECHNOLOGY LTD

USA . 11,568 parts In-Stock

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Metaverse IC Inc.

Canada . 4,640 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,896 parts In-Stock

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Corphita

USA . 3,653 parts In-Stock

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Kepictronics

USA . 900 parts In-Stock

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Microchip USA

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Overview

Elevate your electronics with the LP2960AIMX-3.3 by Texas Instruments, a top-of-the-line fixed & adjustable regulator that delivers unparalleled quality and performance. Manufactured with precision and expertise, this LDO regulator is perfect for a wide range of applications, offering stable output voltage and efficient power management. With its compact design and advanced technology, this product provides customers with reliable and consistent power supply, ultimately enhancing the functionality and longevity of their devices. Choose Texas Instruments for superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable or long-lasting applications.

Maximum Dropout Voltage: 1.8 V

With a low maximum dropout voltage of 1.8V, this regulator can maintain a stable output even when the input voltage drops, ensuring reliable performance in various conditions.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Technology: BIPOLAR

The bipolar technology used ensures high precision and efficiency in regulation, leading to accurate and consistent output voltage levels.

Minimum Output Voltage: 3.254 V

The minimum output voltage of 3.254V allows for a wide range of output voltage options, making this regulator suitable for diverse applications.

No. of Terminals: 16

With 16 terminals, this regulator offers a variety of connection options, allowing for versatile circuit designs and configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices or densely populated circuit boards.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and reliability, ensuring secure connections and long-term performance.

Maximum Output Current: 1.5 A

With a maximum output current of 1.5A, this regulator can deliver sufficient power for a wide range of applications, from small electronics to power-hungry devices.

Technical Specifications

Fixed & Adjustable Regulators - Positive Single Output LDO LP2960AIMX-3.3 attributes and parameters. Explore more Fixed & Adjustable Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.8 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

3.346 V

Minimum Output Voltage-1:

3.254 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification Status:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

3.9 mm

Trade Compliance

LP2960AIMX-3.3 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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