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LP2953AMWG/883

Texas Instruments

LP2953AMWG/883 by Texas Instruments

LP2953AMWG/883 by Texas Instruments is a MIL-STD-883 compliant LDO regulator with 0.8V dropout voltage, 5V nominal output, and 29V max output. Ideal for applications requiring stable voltage supply in harsh environments due to its ceramic-metal package and -55°C to 150°C operating range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,129 parts In-Stock

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4,129

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Digiode

USA . 1,692 parts In-Stock

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Anansix

USA . 1,330 parts In-Stock

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1,330

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 123 parts In-Stock

1+ parts

$4.128

100+ parts

-

1k+ parts

$4.579

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123

$4.128

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$4.579

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DigiPath Technology Company

USA . 2,155 parts In-Stock

1+ parts

$4.545

100+ parts

$4.182

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2,155

$4.545

$4.182

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ChromeModa Solutions

Germany . 772 parts In-Stock

1+ parts

$4.638

100+ parts

$3.803

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772

$4.638

$3.803

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IDEA Electronic Components Group

UK . 766 parts In-Stock

1+ parts

$4.638

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$4.174

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766

$4.638

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$4.174

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AZTECH Wire

Italy . 235 parts In-Stock

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$13.242

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235

$13.242

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One Stop Electronics

USA . 727 parts In-Stock

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$20.500

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727

$20.500

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Corphita

USA . 901 parts In-Stock

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Overview

Experience ultimate performance and reliability with the LP2953AMWG/883 by Texas Instruments, a top-tier manufacturer known for cutting-edge technology and innovation. This fixed & adjustable regulator offers seamless power management solutions for a wide range of applications. From industrial to aerospace, this product delivers superior quality and efficiency, ensuring optimal functionality in any environment. Trust Texas Instruments to provide unmatched value and benefits that exceed expectations, making the LP2953AMWG/883 the ideal choice for your power regulation needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability to the regulator, ensuring long-lasting performance.

Maximum Dropout Voltage: 1.8 V

Low dropout voltage allows for more efficient power regulation, minimizing power loss.

Surface Mount: YES

Ease of installation and space-saving design make it suitable for various applications.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range ensures stable performance in extreme conditions.

Screening Level: MIL-STD-883

Compliance with military-grade standards ensures high quality and reliability.

Technology: BIPOLAR

Bipolar technology offers precise voltage regulation and low noise operation.

Nominal Output Voltage-1: 5 V

Stable output voltage of 5V makes it suitable for a wide range of electronic devices.

Maximum Output Current-1: 0.25 A

Capable of delivering a decent amount of current, making it suitable for various power requirements.

Technical Specifications

Fixed & Adjustable Regulators - Positive Single Output LDO LP2953AMWG/883 attributes and parameters. Explore more Fixed & Adjustable Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.8 V

JESD-30 Code:

R-CDSO-G16

Length:

9.91 mm

No. of Functions:

1

No. of Terminals:

16

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Output Current-1:

.25 A

Maximum Output Voltage-1:

29 V

Minimum Output Voltage-1:

1.23 V

Nominal Output Voltage-1:

5 V

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

SOP

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.33 mm

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.35 mm

Trade Compliance

LP2953AMWG/883 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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