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LP2951CSDX-3.3

Texas Instruments

LP2951CSDX-3.3 by Texas Instruments

LP2951CSDX-3.3 by Texas Instruments is a fixed/adjustable positive single output LDO regulator with 3.3V nominal output voltage, 0.6V max dropout voltage, and 0.1A max output current. It is used in applications requiring precise voltage regulation in compact spaces with surface mount technology and small outline package style.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip Stock

USA . 5,400 parts In-Stock

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Digiode

USA . 3,206 parts In-Stock

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Vyrian

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Anansix

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Nova Conductors

Japan . 100 parts In-Stock

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One Stop Electronics

USA . 611 parts In-Stock

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$3.500

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Parana Technologies

USA . 873 parts In-Stock

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$4.582

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$5.040

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IDEA Electronic Components Group

UK . 2,364 parts In-Stock

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$5.148

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$4.633

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ChromeModa Solutions

Germany . 1,942 parts In-Stock

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$5.148

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$4.221

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Semicontronic

India . 809 parts In-Stock

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$6.500

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$6.338

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$6.305

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$6.500

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Corohmni

South Africa . 38 parts In-Stock

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$8.841

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Ampacity Inc.

Singapore . 1,629 parts In-Stock

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AZTECH Wire

Italy . 424 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Argo Parts USA

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DigiPath Technology Company

USA . 2,247 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Microchip USA

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Bastille Electronics

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Overview

Discover the reliable LP2951CSDX-3.3 by Texas Instruments, a top-tier manufacturer of cutting-edge electronic components. This fixed & adjustable regulator offers unparalleled performance and efficiency in powering various applications. With a compact design and high-quality construction, this LDO regulator ensures stable output voltage and minimal dropout voltage for optimal functionality. Experience the value and benefits of Texas Instruments' expertise with the LP2951CSDX-3.3, providing customers with superior power management solutions for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package, ensuring reliability and ease of handling.

Maximum Dropout Voltage-1: 1.6 V

Low dropout voltage ensures efficient power conversion with minimal loss.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and facilitating mass production.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range makes it suitable for a variety of environments and applications.

Technology: BIPOLAR

Bipolar technology provides stable and reliable performance for voltage regulation.

Package Shape: SQUARE

Compact square shape for efficient use of space on the circuit board.

Terminal Form: NO LEAD

Lead-free terminals for environmentally friendly manufacturing and compliance with regulations.

Operating Temperature (TJ-Min): -40 °C

Operates in low temperature conditions without compromising performance.

Packing Method: TR

Suitable packaging method for storage, transport, and distribution of the product.

Minimum Output Voltage-1: 1.24 V

Low minimum output voltage for a wide range of applications requiring lower voltage levels.

Maximum Voltage Tolerance: 2.4 %

Tight voltage tolerance ensures consistent and accurate output voltage regulation.

Nominal Output Voltage-1: 3.3 V

Stable nominal output voltage for reliable power supply to connected devices.

No. of Terminals: 8

Sufficient number of terminals for proper connectivity and secure attachment to the circuit board.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact package style with heat sink for efficient heat dissipation and space-saving design.

Adjustability: FIXED/ADJUSTABLE

Option for fixed or adjustable output voltage, providing flexibility for different applications.

Terminal Pitch: 0.8 mm

Narrow terminal pitch for compact layout and efficient use of space on the circuit board.

Maximum Line Regulation: 0.0132 %

Low line regulation for stable output voltage under varying input conditions.

Regulator Type: FIXED/ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

Positive single output regulator with low dropout for efficient voltage regulation.

Terminal Finish: TIN LEAD

Tin lead finish on terminals for reliable connectivity and soldering during installation.

Terminal Position: DUAL

Dual terminal position for secure attachment and stability on the circuit board.

Maximum Output Voltage-1: 29 V

High maximum output voltage for powering various devices and components.

Maximum Seated Height: 0.8 mm

Low seated height for minimal profile and space-saving installation.

Width: 4 mm

Compact width for efficient use of space on the circuit board.

Maximum Load Regulation: 0.0099 %

Low load regulation for stable output voltage under varying load conditions.

Maximum Output Current-1: 0.1 A

Sufficient maximum output current for powering small to medium load devices.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable soldering during assembly.

Nominal Dropout Voltage-1: 0.38 V

Low nominal dropout voltage for efficient power conversion and minimal voltage loss.

Length: 4 mm

Compact length for efficient use of space on the circuit board.

Maximum Input Voltage Absolute: 30 V

High maximum input voltage for compatibility with various power sources.

Technical Specifications

Fixed & Adjustable Regulators - Positive Single Output LDO LP2951CSDX-3.3 attributes and parameters. Explore more Fixed & Adjustable Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Adjustability:

FIXED/ADJUSTABLE

Maximum Dropout Voltage-1:

.6 V

Nominal Dropout Voltage-1:

.38 V

Maximum Input Voltage Absolute:

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e0

Length:

4 mm

Maximum Line Regulation:

.0132 %

Maximum Load Regulation:

.0099 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

29 V

Minimum Output Voltage-1:

1.24 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.15,32

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

Width:

4 mm

Trade Compliance

LP2951CSDX-3.3 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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