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LP239DR

Texas Instruments

LP239DR by Texas Instruments

LP239DR by Texas Instruments is a comparator with 4 functions, featuring a max input offset voltage of 9000 uV and max average bias current of 0.04 uA. It operates at temperatures ranging from -25 to 85 °C and is ideal for applications requiring open-collector output type in small outline packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,549 parts In-Stock

1+ parts

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5,549

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Digiode

USA . 1,950 parts In-Stock

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1,950

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,443 parts In-Stock

1+ parts

$0.410

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-

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1,443

$0.410

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Parana Technologies

USA . 714 parts In-Stock

1+ parts

$2.170

100+ parts

-

1k+ parts

$2.683

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714

$2.170

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$2.683

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ChromeModa Solutions

Germany . 2,364 parts In-Stock

1+ parts

$2.438

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$1.999

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2,364

$2.438

$1.999

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IDEA Electronic Components Group

UK . 1,712 parts In-Stock

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$2.438

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$2.194

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1,712

$2.438

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$2.194

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AZTECH Wire

Italy . 231 parts In-Stock

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$12.838

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231

$12.838

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DigiPath Technology Company

USA . 1,425 parts In-Stock

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100+ parts

$2.198

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1,425

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$2.198

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Corphita

USA . 768 parts In-Stock

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Overview

Discover the LP239DR by Texas Instruments, a high-quality comparator that offers unmatched precision and reliability. With a compact design and advanced technology, this product is perfect for a wide range of applications. From industrial automation to consumer electronics, this versatile component ensures optimal performance and efficiency. Trust in Texas Instruments' reputation for excellence and experience the value and benefits that the LP239DR brings to your projects. Elevate your designs with this top-tier comparator today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good protection and durability for the package body, ensuring long-lasting performance.

Maximum Input Offset Voltage: 9000 uV

High maximum input offset voltage allows for more precise and accurate comparisons between input signals.

Maximum Average Bias Current (IIB): 0.04 uA

Low average bias current helps in reducing power consumption and improving overall efficiency.

Surface Mount: YES

Surface mount capability makes installation easier and more streamlined in various electronic applications.

No. of Functions: 4

With 4 functions, this product offers versatility and can handle multiple tasks effectively.

Nominal Supply Voltage / Vsup (V): 5

Stable nominal supply voltage of 5V ensures consistent and reliable performance.

Maximum Supply Voltage Limit: 36 V

High maximum supply voltage limit allows for use in a wide range of voltage applications.

Maximum Operating Temperature: 85 °C

Wide maximum operating temperature range enables this product to function efficiently in various environmental conditions.

Output Type: OPEN-COLLECTOR

Open-collector output type provides flexibility in interfacing with other components or systems.

Technology: BIPOLAR

Bipolar technology offers higher speed and accuracy compared to other technologies, making this product suitable for precision applications.

Technical Specifications

Comparators LP239DR attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Power Supply:

5 V

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Open-Collector

Performance Specifications

Maximum Input Offset Voltage:

9 mV

Peak Bias Current:

40 nA

Maximum Bias Current (IIB) @25 °C:

25 nA

Operational Characteristics

Maximum Supply Current:

100 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

36 V

Lowest Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Nominal Response Time:

1.3 µs

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

LP239DR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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