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LOG112AIDRE4

Texas Instruments

LOG112AIDRE4 by Texas Instruments

LOG112AIDRE4 by Texas Instruments is a small outline analog computational IC with 1 function. It operates at a nominal voltage of 5V and has a max operating temperature of 85°C. It is commonly used as a log or antilog amplifier in industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,072 parts In-Stock

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5,072

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Digiode

USA . 3,767 parts In-Stock

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3,767

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Nova Conductors

Japan . 21 parts In-Stock

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Parana Technologies

USA . 1,378 parts In-Stock

1+ parts

$1.169

100+ parts

-

1k+ parts

$1.975

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1,378

$1.169

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$1.975

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DigiPath Technology Company

USA . 530 parts In-Stock

1+ parts

$1.287

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$1.184

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-

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530

$1.287

$1.184

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ChromeModa Solutions

Germany . 5,688 parts In-Stock

1+ parts

$1.313

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$1.077

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5,688

$1.313

$1.077

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IDEA Electronic Components Group

UK . 306 parts In-Stock

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$1.313

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$1.182

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306

$1.313

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$1.182

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Ampacity Inc.

Singapore . 1,511 parts In-Stock

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$2.500

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1,511

$2.500

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Semicontronic

India . 1,558 parts In-Stock

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$4.500

100+ parts

$4.388

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$4.365

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1,558

$4.500

$4.388

$4.365

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One Stop Electronics

USA . 682 parts In-Stock

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$4.500

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682

$4.500

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Corohmni

South Africa . 14 parts In-Stock

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$6.750

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14

$6.750

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Advanced Electronics

New Zealand . 52 parts In-Stock

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$7.767

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$7.379

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$7.379

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52

$7.767

$7.379

$7.379

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AZTECH Wire

Italy . 526 parts In-Stock

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$8.281

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526

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Corphita

USA . 4,985 parts In-Stock

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Continental Prestige Electronics

USA . 3,266 parts In-Stock

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Argo Parts USA

USA . 2,806 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Experience the unparalleled quality and excellence of the LOG112AIDRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliability and innovation like no other. This analog computational device opens up endless possibilities in various applications. With its small outline package style and wide temperature range, this product is perfect for industrial use. Its high-performance technology ensures accurate results and efficient operation. Discover the value, benefits, and advantages that the LOG112AIDRE4 offers to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The plastic/epoxy package body material provides durability and protects the internal components of the product, making it ideal for long-term use in various environments.

Surface Mount:

YES - The surface mount feature allows for easy installation and integration into circuit boards, saving time and effort during assembly.

No. of Functions:

1 - With a single function, this product offers a straightforward and focused solution for analog computational needs, simplifying the design process.

Package Shape:

RECTANGULAR - The rectangular shape of the package allows for efficient space utilization and easy placement on circuit boards, optimizing overall design layout.

Nominal Supply Voltage (Vsup):

5 V - The nominal supply voltage of 5V ensures stable and reliable power delivery, providing consistent performance for accurate analog computational tasks.

Power Supplies (V):

+-5 - The dual power supplies of +/-5V offer a wide operating range, allowing for flexibility in various voltage requirements and ensuring compatibility with different systems.

No. of Terminals:

14 - The 14 terminals provide sufficient connectivity options for interfacing with other components, enabling seamless integration within larger electronic systems.

Package Style (Meter):

SMALL OUTLINE - The small outline package style makes this product compact and space-efficient, making it an excellent choice for applications with limited board real estate.

Maximum Operating Temperature:

85 °C - With a maximum operating temperature of 85°C, this product can withstand high temperature environments, ensuring reliable operation even in harsh conditions.

Minimum Operating Temperature:

40 °C - The minimum operating temperature of -40°C allows this product to function reliably in cold environments, expanding its usability in various application scenarios.

Terminal Finish:

NICKEL PALLADIUM GOLD - The nickel palladium gold terminal finish offers excellent corrosion resistance and a reliable electrical connection, ensuring long-lasting performance in diverse operating conditions.

Terminal Position:

DUAL - The dual terminal position facilitates flexible circuit board design and enables easy connections, enhancing the product's versatility and usability.

Maximum Seated Height:

1.75 mm - The low maximum seated height allows for a compact design and compatibility with space-constrained applications, increasing the product's adaptability.

Width (mm):

3.9 mm - The compact width of 3.9mm contributes to space-saving designs, making it an ideal choice for systems with limited board real estate.

Other IC type:

LOG OR ANTILOG AMPLIFIER - With the capability to function as a log or antilog amplifier, this product offers versatility in analog computational applications, expanding its range of uses.

Minimum Supply Voltage (Vsup):

4.5 V - The minimum supply voltage requirement of 4.5V ensures compatibility with a wide range of power sources, allowing for flexible integration into different systems.

Minimum Negative Supply Voltage (Vsup):

4.5 V - The minimum negative supply voltage requirement of -4.5V allows for dual power supply capability and compatibility with systems requiring negative voltage.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during assembly, maximizing product reliability.

Peak Reflow Temperature °C:

260 - The peak reflow temperature of 260°C enables effective soldering of the product during assembly, ensuring secure connections and reliable performance.

Length:

8.65 mm - The compact length of 8.65mm makes this product suitable for applications where space is limited, offering greater flexibility in design.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade allows this product to operate reliably in demanding environments, making it a robust choice for various industrial applications.

Maximum Supply Current (Isup):

1.75 mA - With a maximum supply current of 1.75 mA, this product ensures efficient power consumption, making it ideal for energy-conscious designs.

Technology:

BIPOLAR - The bipolar technology utilized in this product enables accurate and high-performance analog computations, providing precise results in a wide range of applications.

Nominal Bandwidth:

1.4 kHz - The nominal bandwidth of 1.4 kHz enables this product to handle analog computational tasks efficiently, making it suitable for applications requiring real-time processing.

Terminal Form:

GULL WING - The gull wing terminal form simplifies surface mounting and enhances solder joint reliability, ensuring secure connections and robust performance.

Maximum Negative Supply Voltage (Vsup):

18 V - The maximum negative supply voltage of -18V allows for compatibility with systems requiring a broad range of negative voltages, ensuring flexibility in design.

Nominal Negative Supply Voltage (Vsup):

5 V - The nominal negative supply voltage of -5V provides stable power delivery for accurate analog computations, ensuring reliable performance in various applications.

Terminal Pitch:

1.27 mm - The 1.27mm terminal pitch allows for precise and reliable connections, making it easier to integrate this product into circuit boards and ensuring optimal electrical performance.

Moisture Sensitivity Level (MSL):

3 - With an MSL rating of 3, this product demonstrates resistance to moisture and is suitable for use in environments with moderate humidity levels.

Maximum Supply Voltage (Vsup):

18 V - The maximum supply voltage of 18V accommodates a wide range of voltage requirements, making this product versatile for integration into diverse systems.

Maximum Negative Input Voltage:

3.8 V - The maximum negative input voltage of -3.8V ensures compatibility with signals containing negative voltages, making it ideal for a wide range of analog computational tasks.

Maximum Positive Input Voltage:

3.5 V - The maximum positive input voltage of 3.5V allows for compatibility with signals containing positive voltages, expanding the application possibilities of this product.

Technical Specifications

Analog Computational LOG112AIDRE4 attributes and parameters. Explore more Analog Computational devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

1.4 kHz

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

3

Maximum Negative Supply Voltage (Vsup):

-18 V

Minimum Negative Supply Voltage (Vsup):

-4.5 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Maximum Negative Input Voltage:

-3.8 V

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Positive Input Voltage:

3.5 V

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Computational Functions

Maximum Supply Current (Isup):

1.75 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

LOG112AIDRE4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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