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LMX2531LQE1226E/NOPB

Texas Instruments

LMX2531LQE1226E/NOPB by Texas Instruments

LMX2531LQE1226E/NOPB by Texas Instruments is a PLL frequency synthesizer with a max output frequency of 3132 GHz. Operating at a nominal voltage of 3 V, it features a BICMOS technology and is suitable for industrial applications requiring precise frequency synthesis in compact designs. This chip carrier package with matte tin finish offers surface mount capability and operates within a wide temperature range from -40 to 85 °C.

Median Price

$10.508

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,760 parts In-Stock

1+ parts

-

100+ parts

$9.340

1k+ parts

$8.360

10k+ parts

$7.860

1,760

-

$9.340

$8.360

$7.860

Verical

USA . 1,010 parts In-Stock

1+ parts

-

100+ parts

$11.675

1k+ parts

$10.450

10k+ parts

$9.825

1,010

-

$11.675

$10.450

$9.825

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,380 parts In-Stock

1+ parts

$8.208

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2,380

$8.208

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Vyrian

USA . 5,055 parts In-Stock

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$8.640

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5,055

$8.640

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Anansix

USA . 2,639 parts In-Stock

1+ parts

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2,639

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Connector Distribution Corp

USA . 100 parts In-Stock

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100

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Right Parts Inc.

USA . 100 parts In-Stock

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100

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Cogito LLC

Ukraine . 14 parts In-Stock

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14

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,930 parts In-Stock

1+ parts

$7.776

100+ parts

-

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-

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1,930

$7.776

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Parana Technologies

USA . 48 parts In-Stock

1+ parts

$18.532

100+ parts

$1,720.938

1k+ parts

$16.678

10k+ parts

-

48

$18.532

$1,720.938

$16.678

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DigiPath Technology Company

USA . 202 parts In-Stock

1+ parts

$20.406

100+ parts

$18.773

1k+ parts

-

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202

$20.406

$18.773

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IDEA Electronic Components Group

UK . 2,222 parts In-Stock

1+ parts

$20.822

100+ parts

$19.781

1k+ parts

$18.740

10k+ parts

-

2,222

$20.822

$19.781

$18.740

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ChromeModa Solutions

Germany . 1,568 parts In-Stock

1+ parts

$20.822

100+ parts

$17.074

1k+ parts

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1,568

$20.822

$17.074

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Microchip USA

USA . 1,976 parts In-Stock

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1,976

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Perfect Parts

USA . 196 parts In-Stock

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196

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Overview

Unlock a world of precision and reliability with the LMX2531LQE1226E/NOPB by Texas Instruments, a top-tier manufacturer of cutting-edge Phase Locked Loops (PLL) & Frequency Synthesis Circuits. This innovative chip carrier offers unparalleled performance, with a maximum output frequency of 3132 GHz and a temperature grade suitable for industrial applications. Its matte tin terminal finish and very thin profile make it a versatile solution for a range of projects. Trust in Texas Instruments to deliver quality and excellence with every product, ensuring that your designs meet and exceed expectations. Elevate your tech game with the LMX2531LQE1226E/NOPB - the ultimate choice for professionals seeking superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and enhancing the overall design.

Maximum Output Frequency: 3132 GHz

High frequency output capability enables the product to be used in a wide range of applications requiring precise frequency control.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where temperature fluctuations are common.

Technology: BICMOS

Utilizes a combination of bipolar and CMOS technologies, offering the benefits of high-speed performance and low power consumption.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2531LQE1226E/NOPB attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Frequency:

3132 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

49 mA

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

LMX2531LQE1226E/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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