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LMX2216MX

Texas Instruments

LMX2216MX by Texas Instruments

LMX2216MX by Texas Instruments is a double balanced RF/Microwave Mixer with 50 ohm impedance. It operates b/w -10°C to 70°C, covering frequencies from 100 MHz to 2000 MHz. Ideal for applications requiring high frequency mixing in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 29,660 parts In-Stock

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29,660

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Vyrian

USA . 8,593 parts In-Stock

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8,593

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Digiode

USA . 1,613 parts In-Stock

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1,613

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Anansix

USA . 1,078 parts In-Stock

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1,078

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,657 parts In-Stock

1+ parts

$0.789

100+ parts

-

1k+ parts

$1.774

10k+ parts

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1,657

$0.789

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$1.774

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DigiPath Technology Company

USA . 1,955 parts In-Stock

1+ parts

$0.868

100+ parts

$0.799

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1,955

$0.868

$0.799

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IDEA Electronic Components Group

UK . 1,036 parts In-Stock

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$0.886

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$0.797

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1,036

$0.886

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$0.797

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ChromeModa Solutions

Germany . 872 parts In-Stock

1+ parts

$0.886

100+ parts

$0.727

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872

$0.886

$0.727

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One Stop Electronics

USA . 597 parts In-Stock

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$3.000

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597

$3.000

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AZTECH Wire

Italy . 741 parts In-Stock

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$17.155

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741

$17.155

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Component Stockers USA

USA . 689 parts In-Stock

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$99.990

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689

$99.990

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 638 parts In-Stock

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638

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Overview

Elevate your RF/Microwave applications with the high-quality LMX2216MX by Texas Instruments. Manufactured with precision and reliability, this DOUBLE BALANCED mixer offers unparalleled performance from 100 MHz to 2000 MHz. Whether you're in telecommunications, aerospace, or research, this component is designed to meet your demanding needs. Experience seamless integration, superior value, and unmatched benefits with the LMX2216MX – the perfect choice for your next project. Upgrade your systems today and elevate your performance to new heights.

Feature Benefit Bullets

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product is suitable for use in various environments without the risk of overheating.

Minimum Operating Temperature: -10 °C

The minimum operating temperature of -10°C ensures that this product can be used in colder conditions without any performance issues.

RF or Microwave Device Type: DOUBLE BALANCED

The double balanced design of this product helps in reducing unwanted signal mixing and spurious outputs, resulting in cleaner and more accurate RF/microwave signal processing.

Characteristic Impedance: 50 ohm

With a characteristic impedance of 50 ohms, this product is compatible with standard RF/microwave systems, ensuring seamless integration and reliable performance.

Minimum Operating Frequency: 100 MHz

The minimum operating frequency of 100 MHz allows this product to be used in a wide range of applications requiring low-frequency signal processing.

Maximum Operating Frequency: 2000 MHz

The high maximum operating frequency of 2000 MHz makes this product suitable for applications requiring high-frequency signal processing, providing flexibility and versatility.

Technical Specifications

RF/Microwave Mixers LMX2216MX attributes and parameters. Explore more RF/Microwave Mixers devices from Texas Instruments

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Operating Frequency:

2000 MHz

Minimum Operating Frequency:

100 MHz

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

RF or Microwave Device Type:

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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