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LMV824DE4

Texas Instruments

LMV824DE4 by Texas Instruments

LMV824DE4 by Texas Instruments is a quad operational amplifier with 4000uV max input offset voltage and 85dB nominal CMRR. Ideal for industrial applications, it operates b/w -40 to 85 °C with micropower consumption of 1.5mA at max supply voltage of 5.5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,969 parts In-Stock

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Digiode

USA . 533 parts In-Stock

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533

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One Stop Electronics

USA . 1,249 parts In-Stock

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$1.410

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Parana Technologies

USA . 2,362 parts In-Stock

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$2.437

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$2.933

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IDEA Electronic Components Group

UK . 1,831 parts In-Stock

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$2.738

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$2.464

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ChromeModa Solutions

Germany . 1,033 parts In-Stock

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$2.738

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$2.245

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AZTECH Wire

Italy . 566 parts In-Stock

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$16.747

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Component Stockers USA

USA . 621 parts In-Stock

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$99.990

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Corphita

USA . 4,713 parts In-Stock

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DigiPath Technology Company

USA . 860 parts In-Stock

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$2.469

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Microchip USA

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Overview

Experience the precision and reliability of Texas Instruments with the LMV824DE4 Operational Amplifier. This versatile component offers exceptional performance in a range of applications, from industrial automation to consumer electronics. With low bias current, micropower capabilities, and high common mode rejection ratio, this op amp is designed to deliver consistent and accurate results. Trust in Texas Instruments for quality products that provide value and efficiency for your projects. Elevate your designs with the LMV824DE4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the op amp, ensuring long-term reliability.

Maximum Input Offset Voltage: 4000 uV

Low offset voltage ensures accurate signal processing and minimal error in the output signal.

Nominal Common Mode Reject Ratio: 85 dB

High common mode rejection ratio helps in eliminating noise and interference from the input signal, resulting in a cleaner output signal.

Max Supply Voltage Limit: 5.5 V

Wide supply voltage range allows for flexibility in powering the op amp in various applications.

Frequency Compensation: YES

Frequency compensation feature ensures stability and prevents oscillations in the op amp circuit.

Nominal Unity Gain Bandwidth: 5000 kHz

High unity gain bandwidth ensures that the op amp can handle a wide range of frequency signals without distortion.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is suitable for various applications such as signal conditioning, filtering, amplification, and more.

Technical Specifications

Operational Amplifiers (Op Amps) LMV824DE4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

2.5/5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

4000 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

1.7 V/us

Peak Bias Current:

140 nA

Maximum Bias Current (IIB) @25 °C:

100 nA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

5.5 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

1.5 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

LMV824DE4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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