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LMV711IDBVRE4

Texas Instruments

LMV711IDBVRE4 by Texas Instruments

LMV711IDBVRE4 by Texas Instruments is an Operational Amplifier with a max input offset voltage of 3200uV and nominal common mode reject ratio of 75dB. It operates at a supply voltage of 2.7/5V, making it suitable for industrial applications requiring low-bias amplification with a unity gain bandwidth of 5000kHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,443 parts In-Stock

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7,443

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Digiode

USA . 3,429 parts In-Stock

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3,429

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 627 parts In-Stock

1+ parts

$2.597

100+ parts

-

1k+ parts

$3.088

10k+ parts

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627

$2.597

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$3.088

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ChromeModa Solutions

Germany . 1,244 parts In-Stock

1+ parts

$2.918

100+ parts

$2.393

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1,244

$2.918

$2.393

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IDEA Electronic Components Group

UK . 799 parts In-Stock

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$2.918

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$2.626

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799

$2.918

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$2.626

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One Stop Electronics

USA . 941 parts In-Stock

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$8.410

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941

$8.410

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AZTECH Wire

Italy . 432 parts In-Stock

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$15.820

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432

$15.820

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Component Stockers USA

USA . 341 parts In-Stock

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$99.990

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341

$99.990

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DigiPath Technology Company

USA . 1,963 parts In-Stock

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$2.631

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$2.631

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Corphita

USA . 860 parts In-Stock

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860

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Microchip USA

USA . 323 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the Texas Instruments LMV711IDBVRE4 operational amplifier. Manufactured by industry leader Texas Instruments, this op amp offers exceptional quality and precision for a wide range of applications. From industrial to consumer electronics, this compact and versatile device provides high voltage gain, low bias current, and excellent frequency compensation. Trust in Texas Instruments to deliver cutting-edge technology and superior products that meet your needs and exceed your expectations. Elevate your designs with the LMV711IDBVRE4 and unlock endless possibilities in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for various applications and environments.

Maximum Input Offset Voltage: 3200 uV

Low input offset voltage ensures accurate and precise signal processing, making this product ideal for high-performance applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Nominal Common Mode Reject Ratio: 75 dB

High common mode rejection ratio helps in minimizing interference and noise in the signal, resulting in cleaner output signals.

Maximum Supply Voltage Limit: 6 V

Wide supply voltage range allows flexibility in power supply options, making the product versatile for different voltage requirements.

Nominal Unity Gain Bandwidth: 5000 kHz

High unity gain bandwidth enables fast signal processing and response, making the product suitable for applications requiring high-speed operation.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of both bipolar and CMOS technologies, providing high performance, low power consumption, and high speed.

Technical Specifications

Operational Amplifiers (Op Amps) LMV711IDBVRE4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BICMOS

Power Supply:

2.7/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

75 dB

Input Offset Voltage Limit:

3200 uV

Minimum Voltage Gain:

6300

Nominal Slew Rate:

5 V/us

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

1.9 mA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

6

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP6,.11,37

Trade Compliance

LMV711IDBVRE4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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