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LMV551MGX

Texas Instruments

LMV551MGX by Texas Instruments

LMV551MGX by Texas Instruments is a 5-terminal operational amplifier with a max input offset voltage of 4500uV and nominal common mode reject ratio of 92dB. It operates in automotive temperature grade range, making it suitable for precision applications requiring low bias current and high bandwidth performance. The small outline package with thin profile and shrink pitch design allows for space-constrained PCB layouts.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,614 parts In-Stock

1+ parts

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4,614

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Digiode

USA . 2,982 parts In-Stock

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2,982

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Anansix

USA . 562 parts In-Stock

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562

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,028 parts In-Stock

1+ parts

$4.729

100+ parts

-

1k+ parts

$5.226

10k+ parts

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1,028

$4.729

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$5.226

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DigiPath Technology Company

USA . 1,892 parts In-Stock

1+ parts

$5.208

100+ parts

$4.791

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-

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1,892

$5.208

$4.791

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ChromeModa Solutions

Germany . 2,861 parts In-Stock

1+ parts

$5.314

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$4.357

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2,861

$5.314

$4.357

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IDEA Electronic Components Group

UK . 1,867 parts In-Stock

1+ parts

$5.314

100+ parts

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$4.783

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1,867

$5.314

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$4.783

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One Stop Electronics

USA . 843 parts In-Stock

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$8.410

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843

$8.410

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AZTECH Wire

Italy . 802 parts In-Stock

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$16.009

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802

$16.009

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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6,500

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Alle Elektronik GmbH

Germany . 3,527 parts In-Stock

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3,527

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Corphita

USA . 663 parts In-Stock

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663

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Overview

Elevate your electronics projects with the LMV551MGX operational amplifier by Texas Instruments. With a reputation for high-quality components, Texas Instruments delivers reliability and precision in every product. The LMV551MGX excels in a wide range of applications, offering customers exceptional value and performance. Whether you're designing audio equipment, sensors, or automotive systems, this op-amp provides the efficiency and accuracy you need to bring your ideas to life. Trust Texas Instruments to elevate your creations with the LMV551MGX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to moisture and chemicals, making the op amp suitable for a variety of environments.

Maximum Input Offset Voltage: 4500 uV

Low input offset voltage helps in minimizing errors in amplification, making this op amp precise and accurate.

Nominal Common Mode Reject Ratio: 92 dB

High common mode rejection ratio indicates the op amp's ability to reject noise and interference from the input signal, resulting in cleaner output.

Nominal Supply Voltage / Vsup (V): 3

A low supply voltage requirement makes this op amp energy-efficient and ideal for battery-operated devices.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this op amp can be used in harsh environmental conditions without overheating.

Technical Specifications

Operational Amplifiers (Op Amps) LMV551MGX attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

92 dB

Input Offset Voltage Limit:

4500 uV

Nominal Slew Rate:

1 V/us

Peak Bias Current:

38 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Physical Characteristics

Length:

0.079 in (2 mm)

Width:

0.049 in (1.25 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

5

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP5/6,.08

Trade Compliance

LMV551MGX Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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