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LMV393QDRG4Q1

Texas Instruments

LMV393QDRG4Q1 by Texas Instruments

LMV393QDRG4Q1 by Texas Instruments is a dual comparator with 9000uV max input offset voltage and 0.4uA max average bias current. It is ideal for automotive applications due to AEC-Q100 screening, open-collector output type, and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,809 parts In-Stock

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3,809

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Digiode

USA . 3,362 parts In-Stock

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3,362

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Distributors (Availability)

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One Stop Electronics

USA . 362 parts In-Stock

1+ parts

$1.410

100+ parts

-

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362

$1.410

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$3.970

100+ parts

$3.613

1k+ parts

$3.255

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450

$3.970

$3.613

$3.255

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Parana Technologies

USA . 752 parts In-Stock

1+ parts

$5.906

100+ parts

-

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$6.691

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752

$5.906

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$6.691

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ChromeModa Solutions

Germany . 5,863 parts In-Stock

1+ parts

$6.636

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$5.442

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5,863

$6.636

$5.442

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IDEA Electronic Components Group

UK . 1,611 parts In-Stock

1+ parts

$6.636

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$5.972

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1,611

$6.636

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$5.972

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AZTECH Wire

Italy . 358 parts In-Stock

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$14.252

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358

$14.252

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Component Stockers USA

USA . 754 parts In-Stock

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$99.990

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754

$99.990

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A-Z Elektronik GmbH

Germany . 7,031 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,687 parts In-Stock

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Microchip USA

USA . 1,575 parts In-Stock

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1,575

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DigiPath Technology Company

USA . 399 parts In-Stock

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$5.983

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399

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$5.983

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Corphita

USA . 330 parts In-Stock

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Overview

Enhance your automotive applications with the LMV393QDRG4Q1 comparator by Texas Instruments. With a compact design and superior quality, this device offers fast response times and low power consumption, making it ideal for a wide range of automotive electronics. Trust in Texas Instruments' reputation for reliable and innovative semiconductor solutions. Upgrade your designs with the LMV393QDRG4Q1 and experience enhanced performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Maximum Input Offset Voltage: 9000 uV

The high maximum input offset voltage allows for accurate and precise voltage comparison.

Maximum Average Bias Current (IIB): 0.4 uA

With a low maximum average bias current, the product operates efficiently and consumes minimal power.

Surface Mount: YES

The surface mount capability makes it easy to integrate this product onto circuit boards for space-saving and convenient assembly.

No. of Functions: 2

Having 2 functions in one product provides flexibility and saves on component count in circuit designs.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the product meets stringent automotive quality standards, making it suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this product is compatible with standard voltage levels in many electronic systems.

Power Supplies (V): 3/5

Supporting both 3V and 5V power supplies, this product offers flexibility in voltage compatibility.

No. of Terminals: 8

The 8 terminals provide sufficient connection points for interfacing with other components in a circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and is suitable for compact electronic devices.

Maximum Supply Voltage Limit: 5.5 V

The maximum supply voltage limit of 5.5V protects the product from potential overvoltage damage.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand elevated temperature environments.

Output Type: OPEN-COLLECTOR

The open-collector output type allows for easy interfacing with other digital components in the circuit.

Nominal Response Time: 450 ns

The fast nominal response time of 450 nanoseconds enables quick signal processing and decision-making.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

The dual terminal position allows for flexibility in board layout and component placement.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75mm contributes to a slim profile and compact design for space-constrained applications.

Width: 3.9 mm

The narrow width of 3.9mm enables close spacing of components on the PCB, optimizing board real estate.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering of the component during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering and thermal stability during assembly processes.

Length: 4.9 mm

The compact length of 4.9mm contributes to a space-saving design and easy integration into electronic systems.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that the product is designed to operate reliably in automotive environments with varying temperature conditions.

Technology: BIPOLAR

The bipolar technology used in this product ensures high-speed and accurate signal processing, making it suitable for precision applications.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical stability and easy soldering during component assembly.

Amplifier Type: COMPARATOR

Being a comparator amplifier type, this product is designed for comparing input voltages and producing digital outputs based on the comparison results.

Maximum Supply Current: 0.14 mA

With a low maximum supply current of 0.14mA, this product operates efficiently and consumes minimal power.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for easy connectivity and board layout, enhancing ease of installation and assembly.

Technical Specifications

Comparators LMV393QDRG4Q1 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Power Supply:

3/5 V

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Open-Collector

Performance Specifications

Maximum Input Offset Voltage:

9 mV

Peak Bias Current:

400 nA

Maximum Bias Current (IIB) @25 °C:

250 nA

Operational Characteristics

Maximum Supply Current:

140 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

450 ns

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Screening Level:

AEC-Q100

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

LMV393QDRG4Q1 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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