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LMP91200EVAL/NOPB

Texas Instruments

LMP91200EVAL/NOPB by Texas Instruments

LMP91200EVAL/NOPB by Texas Instruments is an Evaluation Board for the LMP91200 Analog Front End (AFE) with SPI Interface. It comes in a Box package and is ideal for testing and demonstrating the functionality of the AFE IC. The board includes necessary components for quick setup and evaluation, making it suitable for development projects requiring precise analog signal processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,171 parts In-Stock

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2,171

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Digiode

USA . 1,866 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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1

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Distributors (Availability)

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AZTECH Wire

Italy . 189 parts In-Stock

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$14.738

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189

$14.738

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One Stop Electronics

USA . 386 parts In-Stock

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$242.100

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386

$242.100

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ChromeModa Solutions

Germany . 3,650 parts In-Stock

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3,650

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Corphita

USA . 3,487 parts In-Stock

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3,487

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IDEA Electronic Components Group

UK . 2,261 parts In-Stock

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2,261

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Parana Technologies

USA . 1,142 parts In-Stock

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$0.461

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DigiPath Technology Company

USA . 654 parts In-Stock

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654

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Overview

Unleash the power of precision with the LMP91200EVAL/NOPB by Texas Instruments. This top-notch evaluation board offers unparalleled quality and reliability, showcasing the excellence that TI is known for. Ideal for analog front-end applications, this board provides a seamless interface and SPI capabilities. Perfect for development projects, the LMP91200EVAL/NOPB delivers unmatched value and benefits to customers looking to take their designs to the next level. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Other Names: LMP91200EVALNOPB

This specific name helps in easily identifying the product in the market or while searching online.

Category: Development Boards, Kits, Programmers, Evaluation Boards

Being in the category of evaluation boards ensures that it is designed for testing and evaluating the performance of the IC LMP91200, making it suitable for development purposes.

Package: Box

The packaging in a box provides a protective and organized storage solution for the evaluation board when not in use, helping to prevent damage.

Type: Interface

As an interface type, this product is designed to facilitate communication between external devices and the IC LMP91200, making it a crucial component for integrating the AFE with other systems.

Function: Analog Front End (AFE)

The AFE functionality allows for the processing and conversion of analog signals, making this evaluation board suitable for applications requiring precise analog signal management.

Utilized IC / Part: LMP91200

This spec indicates that the board is specifically designed for evaluating the performance of the LMP91200 IC, ensuring compatibility and optimal testing conditions.

Supplied Contents: Board(s)

The provision of the evaluation board itself ensures that users have all the necessary components to begin testing and assessing the capabilities of the LMP91200 IC.

Secondary Attributes: SPI Interface

The presence of the SPI interface allows for high-speed and reliable communication between the evaluation board and external systems, enhancing the usability and versatility of the product.

Base Product Number: LMP91200

Being based on the LMP91200 IC ensures that the evaluation board is specifically tailored to provide accurate performance evaluation and testing for this particular integrated circuit.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The MSL level being 1 (Unlimited) indicates that the product is not sensitive to moisture, ensuring durability and reliability even in varying environmental conditions.

Technical Specifications

Additional Parts LMP91200EVAL/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

LMP91200EVALNOPB

Function:

Analog Front End (AFE)

Type:

Interface

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Secondary Attributes:

SPI Interface

Utilized IC / Part:

LMP91200

Package:

Box

Standard Package:

1

Base Product Number:

LMP91200

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

LMP91200EVAL/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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