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LMH730275/NOPB

Texas Instruments

LMH730275/NOPB by Texas Instruments

LMH730275/NOPB by Texas Instruments is a 3-channel Op Amp Evaluation Board in a 16-SSOP Package. It is utilized for development and evaluation purposes, featuring bare board type with bulk packaging. Ideal for applications requiring triple channel amplification, it offers unlimited moisture sensitivity level (MSL) for versatile use.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,727 parts In-Stock

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Digiode

USA . 4,476 parts In-Stock

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Ampacity Inc.

Singapore . 1,173 parts In-Stock

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$12.100

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$12.100

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AZTECH Wire

Italy . 246 parts In-Stock

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$14.028

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One Stop Electronics

USA . 193 parts In-Stock

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$18.100

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Semicontronic

India . 834 parts In-Stock

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$56.100

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$54.698

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$54.417

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834

$56.100

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$54.417

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IDEA Electronic Components Group

UK . 1,706 parts In-Stock

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Corohmni

South Africa . 420 parts In-Stock

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DigiPath Technology Company

USA . 319 parts In-Stock

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Parana Technologies

USA . 123 parts In-Stock

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$0.955

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Corphita

USA . 120 parts In-Stock

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ChromeModa Solutions

Germany . 111 parts In-Stock

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Perfect Parts

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Overview

Elevate your projects with the LMH730275/NOPB by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. This versatile triple-channel op amp evaluation board is a game-changer in the development boards and kits category, offering unmatched performance and reliability. Perfect for a wide range of applications, this board comes in a bulk package and is a must-have for any serious developer looking to take their projects to the next level. Upgrade your toolkit today with the LMH730275/NOPB and experience the benefits of superior quality and innovation.

Feature Benefit Bullets

Other Names: LMH730275

Having a recognizable name makes it easier to identify and locate this specific product for purchase or technical support.

Category: Development Boards, Kits, Programmers / Evaluation Boards / Op Amp Evaluation Boards

This product falls under multiple categories, indicating its versatility and potential applications in various projects.

Package: Bulk

Bulk packaging is cost-effective for purchasing multiple units and is ideal for manufacturers or those who require larger quantities.

Channels per IC: 3 - Triple

Having 3 channels per IC allows for increased functionality and flexibility in signal processing applications.

Board Type: Bare (Unpopulated)

Unpopulated boards provide customization options for the user to add their preferred components, enabling tailored solutions.

Supplied Contents: Board(s)

Includes the necessary board(s) for evaluation and testing, making it convenient for users to start working with the product immediately.

Utilized IC / Part: 16-SSOP Package

Utilizing a 16-SSOP package ensures compatibility with standard IC sockets and facilitates easy integration into existing circuit designs.

Base Product Number: LMH730

Being part of the LMH730 series indicates a high-performance and reliable product line known for quality and innovation.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

With an MSL of 1 (Unlimited), this product can be safely stored and used in various environmental conditions without compromising its performance.

Technical Specifications

Additional Parts LMH730275/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

*LMH730275
*LMH730275/NOPB
LMH730275
LMH730275-NDR
LMH730275-ND
LMH730275NOPB

Channels per IC:

3 - Triple

Category:

Development Boards, Kits, Programmers
Evaluation Boards Op Amp Evaluation Boards

Supplied Contents:

Board(s)

Board Type:

Bare (Unpopulated)

Utilized IC / Part:

16-SSOP Package

Package:

Bulk

Amplifier Type:

General Purpose

Standard Package:

1

Base Product Number:

LMH730

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

LMH730275/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

9030.90.6600

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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