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LMH730033/NOPB

Texas Instruments

LMH730033/NOPB by Texas Instruments

LMH730033/NOPB by Texas Instruments is a single-channel op amp evaluation board in a 14-SOIC package. It features variable gain amplification and comes as a bare board with no components populated. This development kit is ideal for testing and evaluating amplifier circuits in various applications.

Median Price

$12.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Texas Instruments

USA . 23 parts In-Stock

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Mouser Electronics

USA . 2 parts In-Stock

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DigiKey

USA . 1 parts In-Stock

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Digiode

USA . 2,426 parts In-Stock

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$9.500

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Vyrian

USA . 8,859 parts In-Stock

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Semicontronic

India . 9 parts In-Stock

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$8.500

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$8.288

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$8.245

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Corphita

USA . 1,883 parts In-Stock

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Corohmni

South Africa . 124 parts In-Stock

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Component Stockers USA

USA . 4 parts In-Stock

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$11.650

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Parana Technologies

USA . 1,367 parts In-Stock

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DigiPath Technology Company

USA . 1,208 parts In-Stock

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ChromeModa Solutions

Germany . 1,054 parts In-Stock

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IDEA Electronic Components Group

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Overview

Unlock the full potential of your electronic designs with the LMH730033/NOPB by Texas Instruments. Manufactured by a trusted industry leader, this variable gain amplifier evaluation board offers unparalleled quality and reliability. Ideal for development projects requiring precise signal control, this versatile board is a must-have for any engineer looking to optimize performance. Whether you're designing audio equipment or implementing sensor interfaces, the LMH730033/NOPB provides the value, benefits, and advantages needed to take your project to the next level. Elevate your designs with Texas Instruments today!

Feature Benefit Bullets

Other Names: LMH730033NOPB

Easy to identify and search for the product by using the unique part number.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Op Amp Evaluation Boards

Designed for evaluating and testing operational amplifiers, making it suitable for development purposes.

Package: Box

Comes in a protective box packaging, keeping the components safe during storage and shipping.

Channels per IC: 1 - Single

Ideal for applications requiring single channel amplification, simplifying the design and setup.

Amplifier Type: Variable Gain

Offers flexibility in adjusting the gain levels based on the specific requirements of the application.

Board Type: Bare (Unpopulated)

Allows for customization and experimentation by populating the board with components according to user needs.

Supplied Contents: Board(s)

Includes the necessary board(s) for testing and evaluation, providing a complete solution for users.

Utilized IC / Part: 14-SOIC Package

Utilizes a common IC package for easy replacement and compatibility with other components.

Base Product Number: LMH730033

Part of a series of products, ensuring compatibility and integration with other related components.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Designed to withstand various environmental conditions, offering long-term reliability and durability.

Technical Specifications

Additional Parts LMH730033/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

LMH730033NOPB

Channels per IC:

1 - Single

Category:

Development Boards, Kits, Programmers
Evaluation Boards Op Amp Evaluation Boards

Supplied Contents:

Board(s)

Board Type:

Bare (Unpopulated)

Utilized IC / Part:

14-SOIC Package

Package:

Box

Amplifier Type:

Variable Gain

Standard Package:

1

Base Product Number:

LMH730033

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

LMH730033/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

9030.90.6600

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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