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LMH3402IRGET

Texas Instruments

LMH3402IRGET by Texas Instruments

LMH3402IRGET by Texas Instruments is a BICMOS operational amplifier with 2 functions, 24 terminals, and quad terminal position. It operates in industrial temperature range (-40 to 85 °C) and has a compact square package suitable for various applications requiring high-performance amplification.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,714 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,714

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-

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Digiode

USA . 257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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257

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,095 parts In-Stock

1+ parts

$1.410

100+ parts

-

1k+ parts

-

10k+ parts

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1,095

$1.410

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Parana Technologies

USA . 2,001 parts In-Stock

1+ parts

$4.257

100+ parts

-

1k+ parts

$4.688

10k+ parts

-

2,001

$4.257

-

$4.688

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DigiPath Technology Company

USA . 343 parts In-Stock

1+ parts

$4.687

100+ parts

$4.312

1k+ parts

-

10k+ parts

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343

$4.687

$4.312

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ChromeModa Solutions

Germany . 3,596 parts In-Stock

1+ parts

$4.783

100+ parts

$3.922

1k+ parts

-

10k+ parts

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3,596

$4.783

$3.922

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IDEA Electronic Components Group

UK . 570 parts In-Stock

1+ parts

$4.783

100+ parts

-

1k+ parts

$4.305

10k+ parts

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570

$4.783

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$4.305

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AZTECH Wire

Italy . 895 parts In-Stock

1+ parts

$5.330

100+ parts

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10k+ parts

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895

$5.330

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Corphita

USA . 4,046 parts In-Stock

1+ parts

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4,046

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Overview

Upgrade your electronics with the LMH3402IRGET by Texas Instruments, a high-quality operational amplifier that offers unmatched performance and reliability. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology and precision engineering in every product. Perfect for a wide range of applications, this op amp is designed for maximum efficiency and versatility. Experience the value and benefits of Texas Instruments' top-of-the-line components with the LMH3402IRGET.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

No. of Functions: 2

Having multiple functions in one component increases efficiency and saves space on the circuit board.

Package Shape: SQUARE

Square package shape is compact and provides a stable mounting platform, ensuring secure placement on the board.

No. of Terminals: 24

Having more terminals allows for greater flexibility in connections and functionality, making it versatile in use.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers thermal management features for optimal performance in industrial applications with limited space.

Maximum Operating Temperature: 85 °C

Being able to withstand high operating temperatures makes this product suitable for industrial environments where heat can be a concern.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the product can operate effectively in various environmental conditions, making it reliable in diverse applications.

Terminal Position: QUAD

Quad terminal position allows for convenient connection options and simplifies the circuit design process.

Maximum Seated Height: 1 mm

Low seated height enables a more compact design, saving space in applications with height restrictions.

Width: 4 mm

Narrow width facilitates easy placement on the circuit board, especially in densely populated layouts.

Length: 4 mm

Compact length allows for a smaller footprint on the board, contributing to space-saving design considerations.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring reliability and performance under harsh operating conditions commonly found in industrial settings.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of bipolar and CMOS processes, offering high speed, low power consumption, and enhanced performance.

Terminal Form: NO LEAD

No-lead terminal form simplifies the assembly process and improves reliability by eliminating potential solder joint failure points.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier allows for precision signal processing and amplification, making it suitable for a wide range of applications requiring accurate voltage amplification.

Terminal Pitch: 0.5 mm

Fine terminal pitch provides high-density mounting capability, ideal for compact designs and miniaturized electronic devices.

Technical Specifications

Operational Amplifiers (Op Amps) LMH3402IRGET attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BICMOS

Total Functions:

2

Sub-Category:

Operational Amplifiers

Operational Characteristics

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.157 in (4 mm)

Width:

0.157 in (4 mm)

Maximum Seated Height:

0.039 in (1 mm)

Total Terminals:

24

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Quad

Terminal Form:

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

S-XQCC-N24

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Trade Compliance

LMH3402IRGET Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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