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LMH32401IRGTR

Texas Instruments

LMH32401IRGTR by Texas Instruments

LMH32401IRGTR by Texas Instruments is an Operational Amplifier with a max Input Offset Voltage of 20mV, Max Supply Voltage Limit of 3.55V, and Nominal Unity Gain Bandwidth of 450kHz. It is used in automotive applications due to its Temperature Grade and low Seated Height making it suitable for compact designs.

Median Price

$7.651

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,124 parts In-Stock

1+ parts

$7.651

100+ parts

$6.237

1k+ parts

$4.158

10k+ parts

-

13,124

$7.651

$6.237

$4.158

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,669 parts In-Stock

1+ parts

$7.268

100+ parts

-

1k+ parts

-

10k+ parts

-

3,669

$7.268

-

-

-

Vyrian

USA . 5,810 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,810

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,230 parts In-Stock

1+ parts

$2.794

100+ parts

-

1k+ parts

$3.279

10k+ parts

-

1,230

$2.794

-

$3.279

-

ChromeModa Solutions

Germany . 4,891 parts In-Stock

1+ parts

$3.139

100+ parts

$2.574

1k+ parts

-

10k+ parts

-

4,891

$3.139

$2.574

-

-

IDEA Electronic Components Group

UK . 245 parts In-Stock

1+ parts

$3.139

100+ parts

-

1k+ parts

$2.825

10k+ parts

-

245

$3.139

-

$2.825

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Corphita

USA . 1,369 parts In-Stock

1+ parts

$6.886

100+ parts

-

1k+ parts

-

10k+ parts

-

1,369

$6.886

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-

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AZTECH Wire

Italy . 579 parts In-Stock

1+ parts

$13.650

100+ parts

-

1k+ parts

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10k+ parts

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579

$13.650

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-

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DigiPath Technology Company

USA . 311 parts In-Stock

1+ parts

-

100+ parts

$2.830

1k+ parts

-

10k+ parts

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311

-

$2.830

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-

Overview

Unleash the power of precision with the LMH32401IRGTR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality operational amplifiers that are perfect for a wide range of applications. This chip carrier, heat sink/slug, very thin profile package offers unrivaled performance with a nominal supply voltage of 3.3V and a maximum operating temperature of 125°C. Whether you're designing automotive systems or industrial equipment, this operational amplifier provides unmatched value, reliability, and efficiency. Elevate your projects today with the LMH32401IRGTR from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is durable and lightweight, making the op amp suitable for a variety of applications.

Maximum Input Offset Voltage: 20000 uV

The low input offset voltage ensures accurate and precise voltage amplification, making it ideal for precision instrumentation and measurement applications.

Maximum Average Bias Current (IIB): 80 uA

The low bias current helps minimize errors in signal processing and improves overall circuit performance.

Surface Mount: YES

The surface mount capability allows for easy and compact integration onto PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V is common and readily available, making it compatible with a wide range of power sources.

No. of Terminals: 16

Having 16 terminals provides flexibility in circuit connections and allows for more complex circuit designs to be implemented.

Maximum Operating Temperature: 125 °C

The high operating temperature range ensures reliability in harsh environments and industrial applications.

Nominal Unity Gain Bandwidth: 450000 kHz

The high unity gain bandwidth allows for high-frequency signal amplification, making the op amp suitable for audio and RF applications.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is versatile and can be used in various signal processing and control applications.

Technical Specifications

Operational Amplifiers (Op Amps) LMH32401IRGTR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

450 MHz

Input Offset Voltage Limit:

20000 uV

Nominal Slew Rate:

1100 V/us

Peak Bias Current:

80 uA

Operational Characteristics

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage:

3.55 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

33.5 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.039 in (1 mm)

Total Terminals:

16

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Quad

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Standards

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel, 13 Inch

Package Code:

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Equivalence Code:

LCC16,.12SQ,20

Trade Compliance

LMH32401IRGTR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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