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LMH0302SQE

Texas Instruments

LMH0302SQE by Texas Instruments

LMH0302SQE by Texas Instruments is a Line Driver IC with 16 terminals, operating at 3.135-3.465V. It offers differential output and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring high-speed signal transmission in compact spaces.

Median Price

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Lifecycle Status

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In-Stock Inventory

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Anansix

USA . 995 parts In-Stock

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Digiode

USA . 591 parts In-Stock

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Vyrian

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Bristol Electronics

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300

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Nova Conductors

Japan . 200 parts In-Stock

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Dark Horse Electronics

USA . 150 parts In-Stock

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Speed Components Ltd

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NexGen Digital

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Parana Technologies

USA . 1,558 parts In-Stock

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$5.667

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$6.462

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DigiPath Technology Company

USA . 890 parts In-Stock

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$6.240

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$5.740

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IDEA Electronic Components Group

UK . 2,167 parts In-Stock

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$6.367

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$5.730

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ChromeModa Solutions

Germany . 1,386 parts In-Stock

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$6.367

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AZTECH Wire

Italy . 854 parts In-Stock

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One Stop Electronics

USA . 337 parts In-Stock

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Ampacity Inc.

Singapore . 1,366 parts In-Stock

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Lixinc

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Continental Prestige Electronics

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Alle Elektronik GmbH

Germany . 4,290 parts In-Stock

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Corphita

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Argo Parts USA

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Kepictronics

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Bastille Electronics

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Overview

Upgrade your electronic designs with the LMH0302SQE by Texas Instruments, a top-of-the-line line driver that guarantees high-quality performance and reliability. With its cutting-edge technology and precision engineering, this product is perfect for a wide range of applications in various industries. Experience seamless connectivity and enhanced signal transmission with the LMH0302SQE, providing unmatched value and benefits to customers looking for superior solutions. Trust Texas Instruments for exceptional products that deliver results, every time.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and compact mounting on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.465 V

Capable of handling higher supply voltages, providing versatility in different electrical systems.

Package Shape: SQUARE

Square shape allows for efficient use of board space and easy alignment during installation.

No. of Terminals: 16

Sufficient number of terminals for versatile connectivity options in a range of applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Innovative package style with heat sink feature for improved heat dissipation, ensuring optimal performance in industrial environments.

Minimum Supply Voltage: 3.135 V

Low minimum supply voltage requirement for efficient power usage and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments without compromising performance or reliability.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for use in industrial settings with varying temperature conditions.

Terminal Position: QUAD

Quad terminal position for easy and secure connections, enhancing overall device reliability.

Maximum Seated Height: 0.8 mm

Low seated height for a compact design that facilitates installation in space-constrained applications.

Width: 4 mm

Compact width for efficient use of board space and streamlined integration into circuit layouts.

Differential Output: YES

Differential output for improved noise rejection and signal integrity in high-speed data transmission.

Length: 4 mm

Compact length for space-saving design and ease of installation in compact electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination and provides a more environmentally friendly solution.

Input Characteristics: DIFFERENTIAL

Differential input for improved noise immunity and signal strength, ensuring stable and reliable operation.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage for compatibility with common power sources and ease of integration.

Terminal Pitch: 0.65 mm

Narrow terminal pitch for high-density mounting and increased connectivity options in limited space environments.

Interface IC Type: LINE DRIVER

Specifically designed as a line driver, providing high output current capabilities and precise signal amplification.

Technical Specifications

Line Drivers & Receivers LMH0302SQE attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N16

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

LMH0302SQE Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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