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LM95233CISDX

Texas Instruments

LM95233CISDX by Texas Instruments

LM95233CISDX by Texas Instruments is a 13-bit temperature sensor with a max supply voltage of 3.6V and accuracy of 2°C. It features a 2-wire interface, digital output, and operates in temperatures ranging from -40°C to 125°C. Ideal for applications requiring precise temperature monitoring in compact spaces.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 3,937 parts In-Stock

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Anansix

USA . 1,485 parts In-Stock

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Digiode

USA . 949 parts In-Stock

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Nova Conductors

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Parana Technologies

USA . 2,363 parts In-Stock

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$2.221

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$2.727

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DigiPath Technology Company

USA . 1,429 parts In-Stock

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$2.446

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$2.250

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ChromeModa Solutions

Germany . 4,261 parts In-Stock

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$2.496

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$2.047

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IDEA Electronic Components Group

UK . 901 parts In-Stock

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$2.496

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$2.246

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AZTECH Wire

Italy . 728 parts In-Stock

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$18.882

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Ampacity Inc.

Singapore . 1,514 parts In-Stock

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$27.750

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One Stop Electronics

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Lixinc

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Kepictronics

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Argo Parts USA

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Corphita

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Elevate your temperature sensing capabilities with the LM95233CISDX from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality temperature sensors designed for precision and reliability. This innovative sensor offers a wide range of applications, providing accurate temperature measurements with ease. Whether you're monitoring equipment performance or ensuring product quality, the LM95233CISDX is the ideal solution for your needs. Trust in Texas Instruments to deliver value, benefits, and advantages that exceed expectations. Upgrade to the LM95233CISDX today and experience the difference in temperature sensing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and resistance to environmental factors, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in the power source selection and compatibility with different systems.

No. of Bits: 13

The high number of bits ensures accurate temperature readings and precise measurements.

Body Width: 4 inch

The compact size of the body width enables easy integration and installation in space-constrained environments.

Power Supplies (V): 3.3

The standard power supply voltage of 3.3V ensures compatibility with a wide range of systems and applications.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

The multiple sensor types provide versatility in monitoring temperature and output options for various control systems.

No. of Terminals: 14

The high number of terminals allows for robust connectivity and expanded functionality in complex systems.

Body Height: 0.8 mm

The slim body height enables easy integration in tight spaces and minimizes interference with other components.

Package Shape or Style: SQUARE

The square package shape offers efficient use of space and facilitates uniform mounting for consistent performance.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and extends the lifespan of the sensor.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows the sensor to function reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range ensures the sensor can operate in extreme cold conditions without performance degradation.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent conductivity and solderability for secure connections and reliable data transmission.

Maximum Operating Current: 0.57 mA

The low maximum operating current ensures energy efficiency and reduces the risk of overheating during prolonged use.

Maximum Accuracy °C: 2

The high accuracy of 2°C ensures precise temperature measurements for critical applications and control systems.

Body Length/Diameter: 4 mm

The compact body length/diameter allows for versatile mounting options and easy integration in diverse applications.

Termination Type: SOLDER

The solder termination type provides a reliable and secure connection for stable data transmission and operational consistency.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies connectivity and communication with external systems, enhancing compatibility and ease of use.

Mounting Feature: SURFACE MOUNT

The surface mounting feature offers convenient installation and secure attachment to PCBs or other surfaces for stable operation.

Technical Specifications

Temperature Sensors LM95233CISDX attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

2

Body Width:

4 inch

Body Height:

.8 mm

Body Length/Diameter:

4 mm

JESD-609 Code:

e0

Mounting Feature:

No. of Bits:

13

No. of Terminals:

14

Maximum Operating Current:

.57 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOLCC14,.16,20

Package Shape or Style:

Power Supplies (V):

3.3

Sub-Category:

Other Sensors/Transducers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Terminal Finish:

TIN LEAD

Termination Type:

SOLDER

Trade Compliance

LM95233CISDX Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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