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LM89CIMMX/NOPB

Texas Instruments

LM89CIMMX/NOPB by Texas Instruments

LM89CIMMX/NOPB by Texas Instruments is an 8-bit temperature sensor with a max supply voltage of 3.6V and operating temperatures from 0 to 125°C. It features a 2-wire interface, digital output, and is ideal for applications requiring precise temperature monitoring in compact spaces.

Median Price

$2.081

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 80,193 parts In-Stock

1+ parts

$2.081

100+ parts

$1.823

1k+ parts

$1.030

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80,193

$2.081

$1.823

$1.030

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Distributors (In-Stock)

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Digiode

USA . 1,687 parts In-Stock

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$1.977

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1,687

$1.977

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Vyrian

USA . 381 parts In-Stock

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$2.081

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381

$2.081

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Anansix

USA . 780 parts In-Stock

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780

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Distributors (Availability)

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Parana Technologies

USA . 959 parts In-Stock

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$1.551

100+ parts

-

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$2.199

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959

$1.551

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$2.199

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DigiPath Technology Company

USA . 1,785 parts In-Stock

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$1.708

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$1.571

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$1.708

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ChromeModa Solutions

Germany . 2,014 parts In-Stock

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$1.743

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$1.429

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2,014

$1.743

$1.429

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IDEA Electronic Components Group

UK . 799 parts In-Stock

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$1.743

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$1.569

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799

$1.743

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Corphita

USA . 3,089 parts In-Stock

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$1.873

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Kepictronics

USA . 35,620 parts In-Stock

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S.R.D Solutions

India . 1,100 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Enhance your temperature sensing applications with the LM89CIMMX/NOPB by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in the form of temperature sensors. This versatile sensor provides accurate readings with a maximum accuracy of 3°C, making it ideal for various industries such as automotive, industrial, and consumer electronics. Its compact size and low power consumption of 1.7 mA ensure optimal performance without compromising efficiency. Trust in Texas Instruments to bring you the best in temperature sensing solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the sensor lightweight and durable, suitable for various applications.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this sensor can be used in systems with different power requirements.

No. of Bits: 8

The 8-bit resolution provides sufficient accuracy for temperature sensing applications.

Body Width: 3 inch

The compact body width allows for easy installation in tight spaces or on PCBs with limited real estate.

Power Supplies (V): 3.3

The sensor is designed to operate efficiently with a power supply of 3.3V, which is a common voltage level in many electronic devices.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

This sensor offers multiple output options, making it versatile for different types of temperature monitoring and control applications.

No. of Terminals: 8

The 8 terminals provide a secure and stable connection for data transmission and power supply.

Body Height: 0.86 mm

The low profile body height allows for discrete placement in compact devices or systems.

Package Shape or Style: SQUARE

The square package shape is easy to mount and align on circuit boards, enhancing the ease of integration.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range enables reliable temperature measurement in harsh environments.

Minimum Operating Temperature: 0 °C

The sensor can accurately measure temperatures down to 0°C, suitable for various monitoring applications.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent conductivity and corrosion resistance for long-term reliability.

Maximum Operating Current: 1.7 mA

The low operating current consumption helps in minimizing power consumption, ideal for battery-operated devices.

Housing: PLASTIC

The plastic housing offers insulation and protection for the internal components, ensuring durability and safety.

Maximum Accuracy °C: 3

With a maximum accuracy of 3°C, this sensor provides precise temperature readings for critical applications.

Body Length/Diameter: 3 mm

The compact body length/diameter allows for easy integration into various systems without taking up much space.

Termination Type: SOLDER

The solder termination type ensures a secure and reliable connection with the circuit board for stable performance.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the communication process with the sensor, making it easier to integrate into different systems.

Mounting Feature: SURFACE MOUNT

The surface mount feature enables quick and secure mounting of the sensor on PCBs, saving space and facilitating automated assembly processes.

Technical Specifications

Temperature Sensors LM89CIMMX/NOPB attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

3

Body Width:

3 inch

Body Height:

.86 mm

Body Length/Diameter:

3 mm

Housing:

PLASTIC

JESD-609 Code:

e3

Mounting Feature:

No. of Bits:

8

No. of Terminals:

8

Maximum Operating Current:

1.7 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

TSSOP8,.19

Package Shape or Style:

Power Supplies (V):

3.3

Sub-Category:

Other Sensors/Transducers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Terminal Finish:

MATTE TIN

Termination Type:

SOLDER

Trade Compliance

LM89CIMMX/NOPB Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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