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LM8801TMX-2.9

Texas Instruments

LM8801TMX-2.9 by Texas Instruments

Texas Instruments' LM8801TMX-2.9 is a voltage-mode switching regulator with a max output current of 1.3A and a nominal output voltage of 2.9V, suitable for applications requiring precise power management in compact spaces. With a very thin profile and fine pitch package style, it operates efficiently at temperatures ranging from -30 to 85°C, making it ideal for various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,781 parts In-Stock

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Anansix

USA . 1,874 parts In-Stock

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Digiode

USA . 1,764 parts In-Stock

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One Stop Electronics

USA . 1,263 parts In-Stock

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$4.500

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AZTECH Wire

Italy . 533 parts In-Stock

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$16.430

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533

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Parana Technologies

USA . 70 parts In-Stock

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$17.840

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$18.019

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70

$17.840

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$18.019

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DigiPath Technology Company

USA . 709 parts In-Stock

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$19.644

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$18.073

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709

$19.644

$18.073

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ChromeModa Solutions

Germany . 5,736 parts In-Stock

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$20.045

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$16.437

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$20.045

$16.437

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IDEA Electronic Components Group

UK . 1,806 parts In-Stock

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$20.045

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$19.043

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$18.040

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Lixinc

USA . 8,483 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,611 parts In-Stock

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Corphita

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the LM8801TMX-2.9 Switching Regulator. Designed with cutting-edge technology, this high-performance device offers a range of applications in various industries. With its compact size and efficient design, the LM8801TMX-2.9 delivers exceptional value and benefits to customers seeking superior power management solutions. Trust Texas Instruments to provide you with the best in class products for all your switching regulator needs.

Feature Benefit Bullets

Surface Mount YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape RECTANGULAR

Rectangular package shape is commonly used for efficient heat dissipation and easy integration into various electronic devices.

No. of Terminals 6

Having 6 terminals provides flexibility in connections and enables the regulator to handle multiple inputs and outputs.

Control Mode VOLTAGE-MODE

Voltage-mode control offers precise regulation of output voltage, ensuring stable and reliable performance in various operating conditions.

Maximum Output Current 1.3 A

High maximum output current enables the regulator to supply power to demanding components or circuits, making it suitable for a wide range of applications.

Maximum Switching Frequency 6400 kHz

High switching frequency allows for efficient power conversion and fast response to load changes, resulting in improved overall performance of the regulator.

Technical Specifications

Switching Regulators & Controllers LM8801TMX-2.9 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

PFM CONTROL TECHNIQUE ALSO POSSIBLE

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.3 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

R-XBGA-B6

Length:

1.265 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

1.3 A

Nominal Output Voltage:

2.9 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

6400 kHz

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width (mm):

1.065 mm

Trade Compliance

LM8801TMX-2.9 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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