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LM8801TMX-1.82

Texas Instruments

LM8801TMX-1.82 by Texas Instruments

LM8801TMX-1.82 by Texas Instruments is a VOLTAGE-MODE SWITCHING REGULATOR with 1.3A output current, 6400 kHz switching frequency, and BUCK switcher config. It operates b/w -30 to 85 °C and is ideal for applications requiring a 1.82V output voltage from a 2.3-5.5V input range in compact designs with its very thin profile GRID ARRAY package style.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,051 parts In-Stock

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Anansix

USA . 2,647 parts In-Stock

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Digiode

USA . 1,898 parts In-Stock

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One Stop Electronics

USA . 1,052 parts In-Stock

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$0.500

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$0.500

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Parana Technologies

USA . 1,235 parts In-Stock

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$6.397

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$7.147

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ChromeModa Solutions

Germany . 6,945 parts In-Stock

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$7.188

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$5.894

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IDEA Electronic Components Group

UK . 1,153 parts In-Stock

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$7.188

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$6.469

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AZTECH Wire

Italy . 420 parts In-Stock

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$16.268

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Alle Elektronik GmbH

Germany . 4,367 parts In-Stock

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Corphita

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Kepictronics

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DigiPath Technology Company

USA . 359 parts In-Stock

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Overview

Experience unrivaled performance and reliability with the LM8801TMX-1.82 by Texas Instruments, a cutting-edge switching regulator designed to meet your power management needs. Crafted by industry leader Texas Instruments, this compact and efficient device is perfect for a wide range of applications in various industries. With its advanced features and top-notch quality, the LM8801TMX-1.82 offers unmatched value and benefits to customers looking for precision and stability in their power supply solutions. Choose Texas Instruments for superior performance that you can trust.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on a surface, making it convenient for assembly and installation.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a PCB, enabling compact designs.

No. of Terminals: 6

Having 6 terminals provides flexibility in connections and enables versatile applications.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch helps in achieving high density mounting and reducing footprint on PCBs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation and stability in output voltage, enhancing performance.

Minimum Operating Temperature: -30 °C

Wide temperature range from -30°C to 85°C ensures reliable operation in various temperature environments.

Terminal Position: BOTTOM

Bottom terminal position allows for easy accessibility and connectivity in circuit designs.

Maximum Seated Height: 0.675 mm

Low maximum seated height contributes to a slim profile and space-saving design.

Width (mm): 1.065 mm

Compact width dimension helps in designing smaller and more efficient electronic devices.

Other IC type: SWITCHING REGULATOR

Being a switching regulator IC type ensures efficient power conversion and regulation.

Nominal Input Voltage: 3.6 V

The nominal input voltage of 3.6V is suitable for various electronic applications and power sources.

Length: 1.265 mm

Short length dimension enables space-efficient placement on PCBs and compact device design.

Maximum Switching Frequency: 6400 kHz

High switching frequency allows for rapid voltage conversion, enhancing efficiency and performance.

Maximum Output Current: 1.3 A

Capable of delivering a maximum output current of 1.3A, making it suitable for powering a range of components.

Terminal Form: BALL

Ball terminal form facilitates soldering and connection reliability in the circuit assembly process.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique ensures precise output voltage regulation and efficiency.

Switcher Config: BUCK

Buck switcher configuration provides step-down voltage conversion, ideal for various power supply applications.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4mm enables high-density mounting and compact PCB designs.

Minimum Input Voltage: 2.3 V

The minimum input voltage of 2.3V allows for operation with low-power sources and efficient power conversion.

Nominal Output Voltage: 1.82 V

The nominal output voltage of 1.82V provides stable and regulated power output for electronic components.

Maximum Input Voltage: 5.5 V

Support for a maximum input voltage of 5.5V allows compatibility with a wide range of power sources.

Technical Specifications

Switching Regulators & Controllers LM8801TMX-1.82 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

PFM CONTROL TECHNIQUE ALSO POSSIBLE

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.3 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

R-XBGA-B6

Length:

1.265 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

1.3 A

Nominal Output Voltage:

1.82 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

6400 kHz

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width (mm):

1.065 mm

Trade Compliance

LM8801TMX-1.82 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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