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LM7705MME

Texas Instruments

LM7705MME by Texas Instruments

LM7705MME by Texas Instruments is a small outline analog circuit with 8 terminals, operating b/w -40°C to 125°C. It has a nominal voltage of 5V and can handle up to 5.25V. This semiconductor is designed for automotive applications, featuring surface mount packaging in a square shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,361 parts In-Stock

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4,361

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Vyrian

USA . 3,045 parts In-Stock

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3,045

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Anansix

USA . 2,281 parts In-Stock

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2,281

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Prism Electronics

USA . 33 parts In-Stock

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33

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Distributors (Availability)

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One Stop Electronics

USA . 902 parts In-Stock

1+ parts

$4.500

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902

$4.500

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Parana Technologies

USA . 1,781 parts In-Stock

1+ parts

$14.723

100+ parts

$1,367.279

1k+ parts

$13.251

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1,781

$14.723

$1,367.279

$13.251

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DigiPath Technology Company

USA . 556 parts In-Stock

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$16.212

100+ parts

$14.915

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556

$16.212

$14.915

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AZTECH Wire

Italy . 266 parts In-Stock

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$16.282

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266

$16.282

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ChromeModa Solutions

Germany . 6,101 parts In-Stock

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$16.543

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$13.565

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6,101

$16.543

$13.565

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IDEA Electronic Components Group

UK . 634 parts In-Stock

1+ parts

$16.543

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$15.716

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$14.889

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634

$16.543

$15.716

$14.889

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Component Stockers USA

USA . 372 parts In-Stock

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$99.990

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372

$99.990

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,000 parts In-Stock

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Corphita

USA . 1,837 parts In-Stock

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Perfect Parts

USA . 37 parts In-Stock

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37

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Overview

Discover the LM7705MME by Texas Instruments, a high-quality Other Function Semiconductor that offers unparalleled reliability and performance. With a focus on automotive applications, this small outline package boasts a nominal supply voltage of 5V, making it ideal for a wide range of electronic devices. Trust in Texas Instruments' reputation for excellence and innovation as you experience the value and benefits this product brings to your projects. Elevate your designs with the LM7705MME and unlock endless possibilities in the world of analog circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to heat, making the product suitable for various environments.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard voltage, compatible with many systems and applications.

Minimum Operating Temperature: -40 °C

Can function in low-temperature environments, offering versatility in usage.

Width (mm): 3 mm

Compact size allows for space-saving installation in tight configurations.

Temperature Grade: AUTOMOTIVE

Certified for automotive applications, ensuring reliability and performance under demanding conditions.

Technical Specifications

Other Function Semiconductors LM7705MME attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.09 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3 mm

Trade Compliance

LM7705MME Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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